CHANG; Hsin-Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHANG; Hsin-Chun.The latest application filed is for "interconnect structure and forming method thereof".

Company Profile

3.6.7

CHANG; Hsin-Chun - Taipei City TW
Chang; Hsin-Chun - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnect Structure And Forming Method Thereof App 20220216165 - LIN; Jian-Hong ; et al.	2022-07-07
Method of fabricating semiconductor device including dummy via anchored to dummy metal layer Grant 11,302,654 - Lin , et al. April 12, 2	2022-04-12
Through-Circuit Vias in Interconnect Structures App 20210375723 - LIN; Jian-Hong ; et al.	2021-12-02
Method Of Fabricating Semiconductor Device App 20200411452 - LIN; Jian-Hong ; et al.	2020-12-31
Semiconductor device including dummy via anchored to dummy metal layer Grant 10,777,510 - Lin , et al. Sept	2020-09-15
Semiconductor device, layout pattern and method for manufacturing an integrated circuit Grant 10,431,541 - Lin , et al. O	2019-10-01
Semiconductor Device, Layout Pattern And Method For Manufacturing An Integrated Circuit App 20180269148 - LIN; Jian-Hong ; et al.	2018-09-20
Semiconductor Device And Method Of Fabrication Thereof App 20180151511 - Lin; Jian-Hong ; et al.	2018-05-31
Method of manufacturing a semiconductor device Grant 9,941,159 - Lin , et al. April 10, 2	2018-04-10
Method Of Manufacturing A Semiconductor Device App 20160372368 - LIN; Jian-Hong ; et al.	2016-12-22
Semiconductor device, layout design and method for manufacturing a semiconductor device Grant 9,449,919 - Lin , et al. September 20, 2	2016-09-20
Semiconductor Device, Layout Design And Method For Manufacturing A Semiconductor Device App 20160240472 - LIN; Jian-Hong ; et al.	2016-08-18
Assembly of a power stapler Grant 6,059,161 - Chang , et al. May 9, 2	2000-05-09

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