CHANG; Hsiao-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHANG; Hsiao-Ming.The latest application filed is for "methods and devices for ai model integrity and secrecy protection".
- CHANG; Hsiao-Ming - New Taipei City TW
- Chang; Hsiao-Ming - New Taipei TW
| Patent | Date |
|---|---|
| Methods And Devices For Ai Model Integrity And Secrecy Protection App 20220164481 - LIN; Tsung-Hsien ; et al. | 2022-05-26 |
| Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component Grant 10,743,411 - Yu , et al. A | 2020-08-11 |
| Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad, and Method for Fabricating the Component App 20200245456 - Kind Code | 2020-07-30 |
| Semiconductor package structure Grant 10,672,677 - Chang , et al. | 2020-06-02 |
| Semiconductor Package Structure App 20180261519 - CHANG; Jing-Yao ; et al. | 2018-09-13 |
| Semiconductor Package Structure App 20170084521 - CHANG; Jing-Yao ; et al. | 2017-03-23 |
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