Chang; Hsiao-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Hsiao-Chuan.The latest application filed is for "light emitting package and led bulb".

Company Profile

0.18.23

Chang; Hsiao-Chuan - Kaohsiung TW
Chang; Hsiao-Chuan - Hsinchu County N/A TW
Chang; Hsiao-Chuan - Kaohsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light emitting package and LED bulb Grant 9,618,191 - Chang , et al. April 11, 2	2017-04-11
Composite raw material, carbon fiber material and method for forming the same Grant 8,865,106 - Way , et al. October 21, 2	2014-10-21
Light Emitting Package And Led Bulb App 20140254181 - Chang; Hsiao-Chuan ; et al.	2014-09-11
Composite Raw Material, Carbon Fiber Material And Method For Forming The Same App 20130164207 - Way; Tun-Fun ; et al.	2013-06-27
Semiconductor package Grant 8,421,242 - Chang , et al. April 16, 2	2013-04-16
Semiconductor package Grant 8,368,216 - Lai , et al. February 5, 2	2013-02-05
Semiconductor device package having a buffer structure and method of fabricating the same Grant 8,274,149 - Chang , et al. September 25, 2	2012-09-25
Semiconductor device package Grant 8,222,733 - Cheng , et al. July 17, 2	2012-07-17
Semiconductor device package having a jumper chip and method of fabricating the same Grant 8,222,726 - Chang , et al. July 17, 2	2012-07-17
Plasticizing Agent, Composition For Polyacrylonitrile-based Precursor And Fabrication Method Of Carbon Fiber App 20120139143 - Way; Tun-Fun ; et al.	2012-06-07
Advanced Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof App 20120119342 - Chang Chien; Pao-Huei ; et al.	2012-05-17
Semiconductor Package And Method For Making The Same App 20120091575 - Lai; Yi-Shao ; et al.	2012-04-19
Semiconductor Package And Method For Making The Same App 20120049360 - Lai; Yi-Shao ; et al.	2012-03-01
Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Grant 8,115,285 - Chen , et al. February 14, 2	2012-02-14
Wafer and semiconductor package Grant 8,110,931 - Chang , et al. February 7, 2	2012-02-07
Semiconductor Package And Method For Making The Same App 20110309516 - Lai; Yi-Shao ; et al.	2011-12-22
Semiconductor package and method for packaging a semiconductor package Grant 8,076,786 - Hung , et al. December 13, 2	2011-12-13
Semiconductor Package App 20110298139 - Lai; Yi-Shao ; et al.	2011-12-08
Semiconductor package and method for making the same Grant 8,072,064 - Lai , et al. December 6, 2	2011-12-06
Semiconductor Package App 20110278739 - Lai; Yi-Shao ; et al.	2011-11-17
Semiconductor package and method for processing and bonding a wire Grant 8,053,906 - Chang , et al. November 8, 2	2011-11-08
Semiconductor Device Package And Method Of Fabricating The Same App 20110233764 - CHANG; Hsiao-Chuan ; et al.	2011-09-29
Semiconductor Device Package And Method Of Fabricating The Same App 20110233749 - CHANG; Hsiao-Chuan ; et al.	2011-09-29
Semiconductor Device Package And Method Of Fabricating The Same App 20110227212 - CHENG; Ming-Hsiang ; et al.	2011-09-22
Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package Grant 8,018,075 - Chang , et al. September 13, 2	2011-09-13
Bonding strength measuring device Grant 7,980,757 - Lai , et al. July 19, 2	2011-07-19
Test Kit For Testing A Chip Subassembly And A Testing Method By Using The Same App 20110156739 - CHANG; Hsiao-Chuan ; et al.	2011-06-30
Semiconductor Package App 20110156243 - CHANG; Hsiao-Chuan ; et al.	2011-06-30
Tenon-and-mortise packaging structure Grant 7,964,949 - Lai , et al. June 21, 2	2011-06-21
Semiconductor Package, Method For Enhancing The Bond Of A Bonding Wire, And Method For Manufacturing A Semiconductor Package App 20100007010 - CHANG; Hsiao Chuan ; et al.	2010-01-14
Semiconductor Package And Method For Processing And Bonding A Wire App 20100007009 - CHANG; Hsiao Chuan ; et al.	2010-01-14
Semiconductor Package And Method For Packaging A Semiconductor Package App 20100007011 - HUNG; Chang Ying ; et al.	2010-01-14
Wafer And Semiconductor Package App 20100007004 - CHANG; Hsiao Chuan ; et al.	2010-01-14
Advanced Quad Flat No Lead Chip Package Having A Protective Layer To Enhance Surface Mounting And Manufacturing Methods Thereof App 20090230526 - Chen; Chien-Wen ; et al.	2009-09-17
Bonding Strength Measuring Device App 20090175312 - Lai; Yi-Shao ; et al.	2009-07-09
Tenon-and-mortise packaging structure App 20090096077 - Lai; Yi-Shao ; et al.	2009-04-16
Package structure and manufacturing method thereof App 20090051048 - Lai; Yi-Shao ; et al.	2009-02-26

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