| Patent | Date |
|---|
Electronic package with multiple electronic components spaced apart by grooves
App 20220278013 - Chang; Hong-Da ; et al. | 2022-09-01 |
Electronic package with multiple electronic components spaced apart by grooves
Grant 11,398,413 - Chang , et al. July 26, 2 | 2022-07-26 |
Electronic Package, Packaging Substrate, And Methods For Fabricating The Same
App 20210104465 - Ding; Jun-Chang ; et al. | 2021-04-08 |
Electronic Package And Method For Fabricating The Same
App 20210074603 - Chang; Hong-Da ; et al. | 2021-03-11 |
Electronic package, packaging substrate, and methods for fabricating the same
Grant 10,903,167 - Ding , et al. January 26, 2 | 2021-01-26 |
Carrying Substrate, Electronic Package Having The Carrying Substrate, And Methods For Manufacturing The Same
App 20200350285 - Ho; Chi-Ching ; et al. | 2020-11-05 |
Electronic Package, Packaging Substrate, And Methods For Fabricating The Same
App 20200203277 - Ding; Jun-Chang ; et al. | 2020-06-25 |
Package Stacked Structure, Method For Fabricating The Same, And Package Structure
App 20200043908 - Chung; Chee-Key ; et al. | 2020-02-06 |
Method For Fabricating Electronic Package Having A Shielding Layer
App 20190214372 - Chang; Hong-Da ; et al. | 2019-07-11 |
Electronic Package And Method For Fabricating The Same
App 20180068983 - Chang; Hong-Da ; et al. | 2018-03-08 |
Semiconductor package having conductive pillars
Grant 9,659,806 - Chang , et al. May 23, 2 | 2017-05-23 |
Package structure and fabrication method thereof
Grant 9,607,974 - Lin , et al. March 28, 2 | 2017-03-28 |
Semiconductor package and fabrication method thereof
Grant 9,520,304 - Chang , et al. December 13, 2 | 2016-12-13 |
Package structure and method for fabricating the same
Grant 9,502,335 - Lai , et al. November 22, 2 | 2016-11-22 |
Fabrication method of wafer level package having a pressure sensor
Grant 9,487,393 - Chang , et al. November 8, 2 | 2016-11-08 |
Package structure and fabrication method thereof
Grant 9,425,119 - Chang , et al. August 23, 2 | 2016-08-23 |
Package Structure And Fabrication Method Thereof
App 20160141227 - Lin; Chun-Tang ; et al. | 2016-05-19 |
Semiconductor Package And Method Of Fabricating The Same
App 20160071784 - Chang; Hong-Da ; et al. | 2016-03-10 |
Fabrication Method Of Wafer Level Package Having A Pressure Sensor
App 20150344299 - Chang; Hong-Da ; et al. | 2015-12-03 |
Package Structure And Method For Fabricating The Same
App 20150325556 - Lai; Chieh-Lung ; et al. | 2015-11-12 |
Wafer level package having a pressure sensor and fabrication method thereof
Grant 9,133,021 - Chang , et al. September 15, 2 | 2015-09-15 |
Package Structure And Fabrication Method Thereof
App 20150162264 - Chang; Hong-Da ; et al. | 2015-06-11 |
Semiconductor Package And Fabrication Method Thereof
App 20150041969 - Chang; Hong-Da ; et al. | 2015-02-12 |
Package structure having micro-electro-mechanical system element and method of fabrication the same
Grant 8,878,356 - Chang , et al. November 4, 2 | 2014-11-04 |
Method for fabricating package structure having MEMS elements
Grant 8,633,048 - Lin , et al. January 21, 2 | 2014-01-21 |
Package Structure Having Micro-electro-mechanical System Element And Method Of Fabrication The Same
App 20130341739 - Chang; Hong-Da ; et al. | 2013-12-26 |
Package Structure Having Mems Element And Fabrication Method Thereof
App 20130320463 - Chang; Hong-Da ; et al. | 2013-12-05 |
Semiconductor package and method of fabricating the same
Grant 8,525,324 - Chang , et al. September 3, 2 | 2013-09-03 |
Semiconductor Package And Method Of Fabricating The Same
App 20130075888 - Chang; Hong-Da ; et al. | 2013-03-28 |
Package structure having MEMS elements and fabrication method thereof
Grant 8,399,940 - Lin , et al. March 19, 2 | 2013-03-19 |
Method For Fabricating Package Structure Having Mems Elements
App 20130017643 - LIN; Chen-Han ; et al. | 2013-01-17 |
Package Structure Having Mems Elements And Fabrication Method Thereof
App 20120292722 - Lin; Chen-Han ; et al. | 2012-11-22 |
Method of making white LED package structure having a silicon substrate
Grant 8,172,632 - Lin , et al. May 8, 2 | 2012-05-08 |
Wafer Level Package Having A Pressure Sensor And Fabrication Method Thereof
App 20120001274 - Chang; Hong-Da ; et al. | 2012-01-05 |
Light emitting diode structure
Grant 7,821,094 - Lin , et al. October 26, 2 | 2010-10-26 |
White LED package structure having a silicon substrate and method of making the same
Grant 7,741,772 - Lin , et al. June 22, 2 | 2010-06-22 |
Method Of Making White Led Package Structure Having A Silicon Substrate
App 20100047942 - Lin; Hung-Yi ; et al. | 2010-02-25 |
Light emitting diode structure and manufacturing method thereof
Grant 7,510,892 - Lin , et al. March 31, 2 | 2009-03-31 |
Light Emitting Diode Structure
App 20090032832 - Lin; Hung-Yi ; et al. | 2009-02-05 |
Light Emitting Diode Package Structure And Method Of Making The Same
App 20080210963 - Lin; Hung-Yi ; et al. | 2008-09-04 |
Light Emitting Diode Structure And Manufacturing Method Thereof
App 20080197370 - Lin; Hung-Yi ; et al. | 2008-08-21 |
White Led Package Structure Having A Silicon Substrate And Method Of Making The Same
App 20080191605 - Lin; Hung-Yi ; et al. | 2008-08-14 |
Led Array Package Structure Having Silicon Substrate And Method Of Making The Same
App 20080194054 - Lin; Hung-Yi ; et al. | 2008-08-14 |
Method For Fabricating Flow Channel Capable Of Balancing Air Pressure
App 20080096137 - Chang; Hong-Da | 2008-04-24 |
Method Of Segmenting A Wafer
App 20060276006 - Yang; Chen-Hsiung ; et al. | 2006-12-07 |
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