Chang; Gun-Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Gun-Ho.The latest application filed is for "semiconductor packages".

Company Profile

4.9.9

Chang; Gun-Ho - Yongin-si KR
Chang; Gun-ho - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages Grant 11,081,425 - Chang , et al. August 3, 2	2021-08-03
Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same Grant 10,872,802 - Chang , et al. December 22, 2	2020-12-22
Semiconductor chip and semiconductor package including the same Grant 10,756,062 - Kim , et al. A	2020-08-25
Semiconductor Packages App 20200144159 - CHANG; Gun-Ho ; et al.	2020-05-07
Semiconductor Chip And Semiconductor Package Including The Same App 20200013753 - Kim; Kyoung-Soo ; et al.	2020-01-09
Method Of Debonding A Carrier Substrate From A Device Substrate, Apparatus For Performing The Same, And Method Of Singulating Se App 20190148207 - CHANG; Gun-Ho ; et al.	2019-05-16
Semiconductor package and method of manufacturing the same Grant 10,026,724 - Kim , et al. July 17, 2	2018-07-17
Semiconductor package and method for fabricating the same Grant 9,966,364 - Chang , et al. May 8, 2	2018-05-08
Semiconductor package and manufacturing method thereof Grant 9,899,337 - Chang , et al. February 20, 2	2018-02-20
Semiconductor Package And Method For Fabricating The Same App 20180040590 - CHANG; Gun Ho ; et al.	2018-02-08
Semiconductor Package And Method Of Manufacturing The Same App 20180006006 - Kim; Ji-hwang ; et al.	2018-01-04
Pre-package and methods of manufacturing semiconductor package and electronic device using the same Grant 9,761,477 - Chang , et al. September 12, 2	2017-09-12
Semiconductor Package And Manufacturing Method Thereof App 20170047294 - CHANG; GUN-HO ; et al.	2017-02-16
Pre-package And Methods Of Manufacturing Semiconductor Package And Electronic Device Using The Same App 20170025302 - Chang; Gun-ho ; et al.	2017-01-26
Pre-package and methods of manufacturing semiconductor package and electronic device using the same Grant 9,478,514 - Chang , et al. October 25, 2	2016-10-25
Pre-package And Methods Of Manufacturing Semiconductor Package And Electronic Device Using The Same App 20160141260 - Chang; Gun-ho ; et al.	2016-05-19

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