Chang Chin, Pao-Hei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chang Chin, Pao-Hei.The latest application filed is for "method for fabricating a stacked chip package".
- Chang Chin, Pao-Hei - Kaohsiung Hsien TW
| Patent | Date |
|---|---|
| Method for fabricating a stacked chip package App 20020094605 - Pai, Tsung-Ming ; et al. | 2002-07-18 |
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