Chang; Chih-Hang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Chih-Hang.The latest application filed is for "bonding process for forming semiconductor device structure".

Company Profile

6.7.8

Chang; Chih-Hang - Taoyuan City TW
Chang; Chih-Hang - Taoyuan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding Process For Forming Semiconductor Device Structure App 20220063993 - Chang; Chih-Hang ; et al.	2022-03-03
Systems and methods for semi-flexible eutectic bonder piece arranegments Grant 11,211,354 - Chang , et al. December 28, 2	2021-12-28
Rough layer for better anti-stiction deposition Grant 11,192,775 - Chang , et al. December 7, 2	2021-12-07
Bonding process for forming semiconductor device structure Grant 11,174,156 - Chang , et al. November 16, 2	2021-11-16
Bonding Process For Forming Semiconductor Device Structure App 20200223689 - Chang; Chih-Hang ; et al.	2020-07-16
Bonding process for forming semiconductor device structure Grant 10,626,010 - Chang , et al.	2020-04-21
Rough Layer For Better Anti-stiction Deposition App 20200024125 - Chang; Chih-Hang ; et al.	2020-01-23
Bonding Process For Forming Semiconductor Device Structure App 20190161344 - CHANG; Chih-Hang ; et al.	2019-05-30
Systems And Methods For Semi-flexible Eutectic Bonder Piece Arrangments App 20190164929 - Chang; Chih-Hang ; et al.	2019-05-30
Rough layer for better anti-stiction deposition Grant 10,273,141 - Chang , et al.	2019-04-30
Method for forming micro-electro-mechanical system (MEMS) device structure Grant 10,112,826 - Chang , et al. October 30, 2	2018-10-30
Method For Forming Micro-electro-mechanical System (mems) Device Structure App 20180148327 - CHANG; Chih-Hang ; et al.	2018-05-31
Rough Layer for Better Anti-Stiction Deposition App 20170305738 - Chang; Chih-Hang ; et al.	2017-10-26
Preconditioning To Enhance Hydrophilic Fusion Bonding App 20170225948 - Hsin; Chien-Ning ; et al.	2017-08-10
Preconditioning to enhance hydrophilic fusion bonding Grant 9,725,312 - Hsin , et al. August 8, 2	2017-08-08

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