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Patent applications and USPTO patent grants for Chang; Chien-Hung.The latest application filed is for "array boundary structure to reduce dishing".
Patent | Date |
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Boundary design to reduce memory array edge CMP dishing effect Grant 11,424,263 - Wu , et al. August 23, 2 | 2022-08-23 |
Array Boundary Structure To Reduce Dishing App 20220115391 - Lin; Meng-Han ;   et al. | 2022-04-14 |
Trench Gate High Voltage Transistor For Embedded Memory App 20220085041 - Wu; Wei Cheng ;   et al. | 2022-03-17 |
Boundary design to reduce memory array edge CMP dishing effect Grant 11,264,402 - Wu , et al. March 1, 2 | 2022-03-01 |
Array boundfary structure to reduce dishing Grant 11,211,388 - Lin , et al. December 28, 2 | 2021-12-28 |
Trench gate high voltage transistor for embedded memory Grant 11,189,628 - Wu , et al. November 30, 2 | 2021-11-30 |
Memory device and manufacturing method thereof Grant 11,177,268 - Wu , et al. November 16, 2 | 2021-11-16 |
NVM memory HKMG integration technology Grant 10,811,426 - Wu , et al. October 20, 2 | 2020-10-20 |
Memory Device And Manufacturing Method Thereof App 20200161319 - WU; Wei-Cheng ;   et al. | 2020-05-21 |
Boundary Design To Reduce Memory Array Edge Cmp Dishing Effect App 20200098778 - Wu; Wei Cheng ;   et al. | 2020-03-26 |
Boundary Design To Reduce Memory Array Edge Cmp Dishing Effect App 20200098777 - Wu; Wei Cheng ;   et al. | 2020-03-26 |
Trench Gate High Voltage Transistor For Embedded Memory App 20190393229 - Wu; Wei Cheng ;   et al. | 2019-12-26 |
Boundary design to reduce memory array edge CMP dishing effect Grant 10,515,977 - Wu , et al. Dec | 2019-12-24 |
Nvm Memory Hkmg Integration Technology App 20190252399 - Wu; Wei Cheng ;   et al. | 2019-08-15 |
Semiconductor Strucutre And Method Of Fabricating The Same App 20190148389 - Lin; Meng-Han ;   et al. | 2019-05-16 |
NVM memory HKMG integration technology Grant 10,276,587 - Wu , et al. | 2019-04-30 |
Boundary Design To Reduce Memory Array Edge Cmp Dishing Effect App 20190035801 - Wu; Wei Cheng ;   et al. | 2019-01-31 |
NVM memory HKMG integration technology Grant 9,947,676 - Wu , et al. April 17, 2 | 2018-04-17 |
Nvm Memory Hkmg Integration Technology App 20180012898 - Wu; Wei Cheng ;   et al. | 2018-01-11 |
NVM Memory HKMG Integration Technology App 20170345832 - Wu; Wei Cheng ;   et al. | 2017-11-30 |
Nvm Memory Hkmg Integration Technology App 20170345841 - Wu; Wei Cheng ;   et al. | 2017-11-30 |
NVM memory HKMG integration technology Grant 9,812,460 - Wu , et al. November 7, 2 | 2017-11-07 |
L-shaped Capacitor In Thin Film Storage Technology App 20160233228 - Chuang; Harry-Hak-Lay ;   et al. | 2016-08-11 |
L-shaped capacitor in thin film storage technology Grant 9,397,112 - Chuang , et al. July 19, 2 | 2016-07-19 |
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