Chang; Chia-Ao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Chia-Ao.The latest application filed is for "method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending".

Company Profile

6.5.6

Chang; Chia-Ao - Jinhu Township TW
- Jinhu Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of Gap Filling Using Conformal Deposition-Annealing-Etching Cycle for Reducing Seam Void and Bending App 20220172958 - Yu; De-Wei ; et al.	2022-06-02
Semiconductor Device and Method for Manufacture App 20220130979 - Chang; Chia-Ao ; et al.	2022-04-28
Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending Grant 11,289,343 - Yu , et al. March 29, 2	2022-03-29
Semiconductor device and method Grant 11,211,470 - Chen , et al. December 28, 2	2021-12-28
Defect filling in patterned layer Grant 11,205,709 - Chang , et al. December 21, 2	2021-12-21
Semiconductor Device and Method App 20210119013 - Chen; Meng-Ku ; et al.	2021-04-22
Method of Gap Filling Using Conformal Deposition-Annealing-Etching Cycle for Reducing Seam Void and Bending App 20200035506A1 -	2020-01-30
Defect Filling in Patterned Layer App 20190393325 - Chang; Chia-Ao ; et al.	2019-12-26
Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending Grant 10,504,747 - Yu , et al. Dec	2019-12-10
Silicon Reflow for Reducing Seam and Void and Bending During Gap Fill App 20190103284 - Yu; De-Wei ; et al.	2019-04-04
FinFET device and method of forming the same Grant 10,115,639 - Li , et al. October 30, 2	2018-10-30
FinFET Device and Method of Forming the Same App 20180151693 - Li; Ping Hung ; et al.	2018-05-31

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