loadpatents
name:-0.0094761848449707
name:-0.0077970027923584
name:-0.0013880729675293
Chang; Cheng-Kai Patent Filings

Chang; Cheng-Kai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Cheng-Kai.The latest application filed is for "electronic package and manufacturing method thereof".

Company Profile
1.6.8
  • Chang; Cheng-Kai - Taichung TW
  • Chang; Cheng-Kai - Tantzu TW
  • Chang; Cheng Kai - Taichung City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package
Grant 11,443,994 - You , et al. September 13, 2
2022-09-13
Electronic package and manufacturing method thereof
Grant 11,398,429 - Chang , et al. July 26, 2
2022-07-26
Electronic Package And Manufacturing Method Thereof
App 20220093518 - Chang; Cheng Kai ;   et al.
2022-03-24
Method for fabricating an encapsulated electronic package using a supporting plate
Grant 11,195,812 - Liao , et al. December 7, 2
2021-12-07
Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die
Grant 11,143,549 - You , et al. October 12, 2
2021-10-12
Electronic package and method for fabricating the same
Grant 11,114,412 - Liao , et al. September 7, 2
2021-09-07
Method For Fabricating Electronic Package
App 20210175196 - Liao; Hsin-Yi ;   et al.
2021-06-10
Electronic Package And Method For Fabricating The Same
App 20210104491 - Liao; Hsin-Yi ;   et al.
2021-04-08
Electronic Package, Electronic Packaging Module Having The Electronic Package, And Method For Fabricating The Electronic Package
App 20210057300 - You; Jin-Wei ;   et al.
2021-02-25
Electronic Packaging Structure And Method For Manufacturing The Same
App 20210018360 - You; Jin-Wei ;   et al.
2021-01-21
Electronic Package And Method Of Fabricating The Same
App 20200365489 - Su; Pin-Jing ;   et al.
2020-11-19
Electronic package and method for fabricating the same
Grant 10,431,535 - Chen , et al. O
2019-10-01
Electronic Package And Method For Fabricating The Same
App 20180316083 - Chen; Jui-Feng ;   et al.
2018-11-01
Electronic Package Structure And Method For Fabricating The Same
App 20180096967 - Tsai; Wen-Jung ;   et al.
2018-04-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed