Chang; Che-Jung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Che-Jung.The latest application filed is for "common mode filter".

Company Profile

0.7.8

Chang; Che-Jung - Taoyuan TW
Chang; Che-Jung - Taoyuan City TW
Chang; Che-Jung - Taichung County TW
Chang; Che-Jung - Dali TW
Chang; Che-Jung - Dali City TW
Chang, Che Jung - Taipei Hsien TW
Chang, Che-Jung - Taichung Hsien TW
Chang, Che-Jung - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Common mode filter Grant 11,451,207 - Chang , et al. September 20, 2	2022-09-20
Common Mode Filter App 20220294406 - Chang; Che-Jung ; et al.	2022-09-15
Circuit board structure and layout structure thereof Grant 11,419,205 - Chang August 16, 2	2022-08-16
Circuit board Grant 11,259,400 - Chang February 22, 2	2022-02-22
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Grant 8,482,139 - Chang , et al. July 9, 2	2013-07-09
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Grant 8,232,145 - Chang , et al. July 31, 2	2012-07-31
Methods Of Promoting Adhesion Between Transfer Molded Ic Packages And Injection Molded Plastics For Creating Over-molded Memory Cards App 20100052155 - Chang; Che-Jung ; et al.	2010-03-04
Methods Of Promoting Adhesion Between Transfer Molded Ic Packages And Injection Molded Plastics For Creating Over-molded Memory Cards App 20100055847 - Chang; Che-Jung ; et al.	2010-03-04
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Grant 7,615,861 - Chang , et al. November 10, 2	2009-11-10
Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards App 20070210444 - Chang; Che-Jung ; et al.	2007-09-13
Remote console for controlling computers via a network App 20030084133 - Chan, Sen-Ta ; et al.	2003-05-01
Multimedia chip package App 20020192863 - Yu, Kevin ; et al.	2002-12-19
Method of fabricating a ground-ball bonding structure without trapped air for tape ball grid array application App 20020093091 - Huang, Chien-Ping ; et al.	2002-07-18
Multimedia chip package App 20020066947 - Yu, Kevin ; et al.	2002-06-06

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