Chang; Bo Soon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Bo Soon.The latest application filed is for "semiconductor packaging identifier".

Company Profile

0.20.0

Chang; Bo Soon - Cupertino CA

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Patent Activity

Patent	Date
Semiconductor packaging identifier Grant 9,263,398 - Chang February 16, 2	2016-02-16
Semiconductor packaging identifier Grant 8,999,752 - Chang April 7, 2	2015-04-07
Integrated circuit package with electrically isolated leads Grant 8,318,547 - Spurlock , et al. November 27, 2	2012-11-27
Semiconductor device packaging using etched leadfingers Grant 7,939,372 - Chang May 10, 2	2011-05-10
Flip-flop semiconductor device packaging using an interposer Grant 7,939,371 - Chang May 10, 2	2011-05-10
System for controlling the processing of an integrated circuit chip assembly line Grant 7,818,085 - Chang October 19, 2	2010-10-19
Integrated back-end integrated circuit manufacturing assembly Grant 7,698,015 - Chang April 13, 2	2010-04-13
Integrated circuit package with electrically isolated leads Grant 7,608,914 - Spurlock , et al. October 27, 2	2009-10-27
Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process Grant 7,105,377 - Chang , et al. September 12, 2	2006-09-12
Method of performing back-end manufacturing of an integrated circuit device Grant 7,045,387 - Chang , et al. May 16, 2	2006-05-16
Method and system for a reject management protocol within a back-end integrated circuit manufacturing process Grant 7,031,791 - Chang April 18, 2	2006-04-18
Integrated back-end integrated circuit manufacturing assembly Grant 6,931,298 - Chang August 16, 2	2005-08-16
Method and system for controlling the processing of an integrated circuit chip assembly line using a central computer system and a common communication protocol Grant 6,901,984 - Chang June 7, 2	2005-06-07
Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process Grant 6,730,532 - Chang , et al. May 4, 2	2004-05-04
Method of performing back-end manufacturing of an integrated circuit device Grant 6,730,545 - Chang , et al. May 4, 2	2004-05-04
Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames Grant 6,649,447 - Chang , et al. November 18, 2	2003-11-18
Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame Grant 6,576,491 - Chang , et al. June 10, 2	2003-06-10
High reliability lead frame and packaging technology containing the same Grant 6,331,728 - Chang , et al. December 18, 2	2001-12-18
Architecture, circuitry and method for configuring volatile and/or non-volatile memory for programmable logic applications Grant 6,215,689 - Chhor , et al. April 10, 2	2001-04-10

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