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name:-0.015244960784912
name:-0.011880159378052
name:-0.00054788589477539
Chandra; Haryanto Patent Filings

Chandra; Haryanto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chandra; Haryanto.The latest application filed is for "laminating encapsulant film containing phosphor over leds".

Company Profile
0.11.9
  • Chandra; Haryanto - Mountain House CA US
  • Chandra; Haryanto - Sunnyvale CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laminating encapsulant film containing phosphor over LEDs
Grant 8,736,036 - Chandra May 27, 2
2014-05-27
Laminating encapsulant film containing phosphor over LEDs
Grant 8,450,147 - Chandra May 28, 2
2013-05-28
Laminating Encapsulant Film Containing Phosphor Over Leds
App 20120187427 - Chandra; Haryanto
2012-07-26
Optical sub-assembly packaging techniques that incorporate optical lenses
Grant 7,431,516 - Mazotti , et al. October 7, 2
2008-10-07
Laminating Encapsulant Film Containing Phosphor Over LEDs
App 20080157103 - Chandra; Haryanto
2008-07-03
Laminating encapsulant film containing phosphor over LEDs
Grant 7,344,952 - Chandra March 18, 2
2008-03-18
Laminating encapsulant film containing phosphor over LEDS
App 20070096131 - Chandra; Haryanto
2007-05-03
Optical sub-assembly packaging techniques that incorporate optical lenses
App 20070071391 - Mazotti; William Paul ;   et al.
2007-03-29
Injection casting system for encapsulating semiconductor devices and method of use
Grant 7,153,462 - Chandra December 26, 2
2006-12-26
Single lens system integrating both transmissive and reflective surfaces for light focusing to an optical fiber and light reflection back to a monitor photodetector
Grant 7,099,536 - Chandra August 29, 2
2006-08-29
Optical sub-assembly packaging techniques that incorporate optical lenses
Grant 7,073,961 - Mazotti , et al. July 11, 2
2006-07-11
Injection casting system for encapsulating semiconductor devices and method of use
App 20050238747 - Chandra, Haryanto
2005-10-27
Optical sub-assembly packaging techniques that incorporate optical lenses
App 20050157990 - Mazotti, William Paul ;   et al.
2005-07-21
Optical sub-assembly packaging techniques that incorporate optical lenses
Grant 6,863,450 - Mazotti , et al. March 8, 2
2005-03-08
Optical sub-assembly packaging techniques that incorporate optical lenses
App 20040109649 - Mazotti, William Paul ;   et al.
2004-06-10
Liquid transfer molding system for encapsulating semiconductor integrated circuits
Grant 6,508,970 - Chandra January 21, 2
2003-01-21
Liquid Transfer Molding System For Encapsulating Semiconductor Integrated Circuits
App 20020158366 - CHANDRA, HARYANTO
2002-10-31
Liquid transfer molding system for encapsulating semiconductor integrated circuits
App 20020153637 - Chandra, Haryanto
2002-10-24

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