loadpatents
Patent applications and USPTO patent grants for Chan; Vincent.The latest application filed is for "modulators of cystic fibrosis transmembrane conductance regulator protein".
Patent | Date |
---|---|
Server public key pinning by URL Grant 10,257,171 - Lyons , et al. | 2019-04-09 |
Locomotive biological machines Grant 10,156,560 - Bashir , et al. Dec | 2018-12-18 |
Modulators of cystic fibrosis transmembrane conductance regulator protein Grant 10,118,916 - Altenbach , et al. November 6, 2 | 2018-11-06 |
Modulators Of Cystic Fibrosis Transmembrane Conductance Regulator Protein App 20170305891 - Altenbach; Robert J. ;   et al. | 2017-10-26 |
Server Public Key Pinning By Url App 20170070486 - Lyons; Mike Arnold ;   et al. | 2017-03-09 |
Microvascular stamp for patterning of functional neovessels Grant 9,533,073 - Kong , et al. January 3, 2 | 2017-01-03 |
API publication on a gateway using a developer portal Grant 9,207,913 - Chan December 8, 2 | 2015-12-08 |
Api Publication On A Gateway Using A Developer Portal App 20150248276 - Chan; Vincent | 2015-09-03 |
Microvascular stamp for patterning of functional neovessels Grant 9,050,180 - Kong , et al. June 9, 2 | 2015-06-09 |
Two stage virus detection Grant 8,935,788 - Diao , et al. January 13, 2 | 2015-01-13 |
Semiconductor chip bump connection apparatus and method Grant 8,378,471 - Topacio , et al. February 19, 2 | 2013-02-19 |
Wagering game with fantasy-sports feature Grant 8,177,644 - Anderson , et al. May 15, 2 | 2012-05-15 |
Lightweight SVM-based content filtering system for mobile phones Grant 8,023,974 - Diao , et al. September 20, 2 | 2011-09-20 |
Die stacking apparatus and method Grant 7,969,020 - Chan , et al. June 28, 2 | 2011-06-28 |
Die Stacking Apparatus And Method App 20100320599 - Chan; Vincent ;   et al. | 2010-12-23 |
Wagering Game With Fantasy-Sports Feature App 20100285857 - Anderson; Peter R. ;   et al. | 2010-11-11 |
Die stacking apparatus and method Grant 7,799,608 - Chan , et al. September 21, 2 | 2010-09-21 |
Lightweight content filtering system for mobile phones Grant 7,756,535 - Diao , et al. July 13, 2 | 2010-07-13 |
Semiconductor Chip Bump Connection Apparatus And Method App 20100140798 - Topacio; Roden R. ;   et al. | 2010-06-10 |
Semiconductor chip bump connection apparatus and method Grant 7,670,939 - Topacio , et al. March 2, 2 | 2010-03-02 |
Semiconductor Chip Bump Connection Apparatus and Method App 20090278264 - Topacio; Roden R. ;   et al. | 2009-11-12 |
Method Of Forming A Three-dimensional Structure Of Unidirectionally Aligned Cells App 20090248145 - Chan; Bee Eng ;   et al. | 2009-10-01 |
Die Stacking Apparatus and Method App 20090032971 - Chan; Vincent ;   et al. | 2009-02-05 |
Circuit Substrate With Plated Through Hole Structure And Method App 20080245555 - Li; Yue ;   et al. | 2008-10-09 |
Multi-die module Grant 7,215,022 - Chan , et al. May 8, 2 | 2007-05-08 |
Video gaming machine with player-selectable banner App 20060030397 - Chan; Vincent | 2006-02-09 |
Multi-die module and method thereof Grant 6,929,976 - Chan , et al. August 16, 2 | 2005-08-16 |
Integrated circuit package and method for making same that employs under bump metalization layer App 20040241906 - Chan, Vincent | 2004-12-02 |
Multi-die module and method thereof App 20040106230 - Chan, Vincent ;   et al. | 2004-06-03 |
Multi-die module and method thereof App 20020195704 - Chan, Vincent ;   et al. | 2002-12-26 |
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