Chan; Tsung-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Tsung-Cheng.The latest application filed is for "method for forming semiconductor device structure having conductive structure with twin boundaries".

Company Profile

3.6.8

Chan; Tsung-Cheng - Nantou TW
CHAN; Tsung-Cheng - Nantou City TW
Chan; Tsung-Cheng - Hsinchu TW
CHAN; Tsung-Cheng - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for forming semiconductor device structure having conductive structure with twin boundaries Grant 10,475,742 - Lin , et al. Nov	2019-11-12
Method for forming semiconductor device structure having conductive structure with twin boundaries Grant 10,283,450 - Lin , et al.	2019-05-07
Method For Forming Semiconductor Device Structure Having Conductive Structure With Twin Boundaries App 20190103351 - LIN; Jian-Hong ; et al.	2019-04-04
Method For Forming Semiconductor Device Structure Having Conductive Structure With Twin Boundaries App 20170338178 - LIN; Jian-Hong ; et al.	2017-11-23
Interconnect structure with twin boundaries and method for forming the same Grant 9,761,523 - Lin , et al. September 12, 2	2017-09-12
Chip Package And Method For Forming The Same App 20170207194 - SHEN; Hsing-Lung ; et al.	2017-07-20
Interconnect Structure With Twin Boundaries And Method For Forming The Same App 20170053865 - LIN; Jian-Hong ; et al.	2017-02-23
Method for preparing nano-sheet array structure of group V-VI semiconductor Grant 9,023,663 - Chueh , et al. May 5, 2	2015-05-05
Method For Preparing Nano-sheet Array Structure Of Group V-vi Semiconductor App 20140329338 - CHUEH; Yu-Lun ; et al.	2014-11-06
Method For Fabricating Copper Nanowire With High Density Twins App 20130270121 - LIAO; Chien-Neng ; et al.	2013-10-17
Method for forming metal film with twins Grant 8,420,185 - Chueh , et al. April 16, 2	2013-04-16
Method For Forming Metal Film With Twins App 20130089674 - CHUEH; Yu-Lun ; et al.	2013-04-11

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