Chan; Tat Chi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Tat Chi.The latest application filed is for "routable electroforming substrate comprising removable carrier".

Company Profile

1.3.8

Chan; Tat Chi - Hong Kong HK
CHAN; Tat Chi - Shatin HK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Routable electroforming substrate comprising removable carrier Grant 10,475,666 - Chan , et al. Nov	2019-11-12
Routable Electroforming Substrate Comprising Removable Carrier App 20180308710 - CHAN; Tat Chi ; et al.	2018-10-25
Display Panel Fabricated On A Routable Substrate App 20180308421 - CHAN; Tat Chi ; et al.	2018-10-25
Pre-plated Lead Frame For Copper Wire Bonding App 20130098659 - KWAN; Yiu Fai ; et al.	2013-04-25
Leadframe treatment for enhancing adhesion of encapsulant thereto Grant 8,012,886 - Kwan , et al. September 6, 2	2011-09-06
Micro-blasting Treatment For Lead Frames App 20100155260 - Kwan; Yiu Fai ; et al.	2010-06-24
Pre-plated leadframe having enhanced encapsulation adhesion Grant 7,691,679 - Kwan , et al. April 6, 2	2010-04-06
Pre-plated Leadframe Having Enhanced Encapsulation Adhesion App 20080233683 - Kwan; Yiu Fai ; et al.	2008-09-25
Leadframe Treatment For Enhancing Adhesion Of Encapsulant Thereto App 20080216921 - KWAN; Yiu Fai ; et al.	2008-09-11
Stamped leadframe and method of manufacture thereof App 20080122048 - Chan; Tat Chi ; et al.	2008-05-29

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