Chan; Sook Woon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Sook Woon.The latest application filed is for "semiconductor device with a heterogeneous solder joint and method for fabricating the same".

Company Profile

6.6.6

Chan; Sook Woon - Melaka MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device With A Heterogeneous Solder Joint And Method For Fabricating The Same App 20220005778 - Lee; Swee Kah ; et al.	2022-01-06
Over-under sensor packaging with sensor spaced apart from control chip Grant 11,174,152 - Chan , et al. November 16, 2	2021-11-16
Manufacturing a package using plateable encapsulant Grant 11,081,417 - Chan , et al. August 3, 2	2021-08-03
Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip App 20200048075 - Chan; Sook Woon ; et al.	2020-02-13
Over-under sensor packaging with sensor spaced apart from control chip Grant 10,501,312 - Chan , et al. Dec	2019-12-10
Semiconductor package and method for fabricating a semiconductor package Grant 10,490,470 - Chong , et al. Nov	2019-11-26
Manufacturing a package using plateable encapsulant App 20190341324 - CHAN; Sook Woon ; et al.	2019-11-07
Semiconductor package with plateable encapsulant and a method for manufacturing the same Grant 10,396,007 - Chan , et al. A	2019-08-27
System And Method For Over Under Sensor Packaging App 20190023561 - Chan; Sook Woon ; et al.	2019-01-24
Semiconductor package and method for fabricating a semiconductor package App 20180174935 - CHONG; Hock Heng ; et al.	2018-06-21
Manufacturing a package using plateable encapsulant App 20170256472 - CHAN; Sook Woon ; et al.	2017-09-07
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device Grant 9,475,691 - Chua , et al. October 25, 2	2016-10-25

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