loadpatents
name:-0.020431041717529
name:-0.018665075302124
name:-0.00048017501831055
Chan; Shiun-Wei Patent Filings

Chan; Shiun-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Shiun-Wei.The latest application filed is for "method of manufacturing light emitting device package".

Company Profile
0.31.24
  • Chan; Shiun-Wei - Hsinchu N/A TW
  • Chan; Shiun-Wei - Hukou N/A TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Light emitting diode package and light emitting device having the same
Grant 8,907,371 - Chan , et al. December 9, 2
2014-12-09
Method of manufacturing encapsulation structure for encapsulating LED chip
Grant 8,802,467 - Chan , et al. August 12, 2
2014-08-12
Method Of Manufacturing Light Emitting Device Package
App 20140134766 - CHAN; SHIUN-WEI ;   et al.
2014-05-15
LED package, method for making the LED package and light source having the same
Grant 8,716,744 - Chan , et al. May 6, 2
2014-05-06
Light emitting device package and method of manufacturing the same
Grant 8,674,394 - Chan , et al. March 18, 2
2014-03-18
Method Of Manufacturing Encapsulation Structure For Encapsulating Led Chip
App 20140051195 - CHAN; SHIUN-WEI ;   et al.
2014-02-20
Light emitting diode module
Grant 8,624,389 - Chan , et al. January 7, 2
2014-01-07
LED package
Grant 8,592,857 - Chan , et al. November 26, 2
2013-11-26
LED package and mold of manufacturing the same
Grant 8,587,012 - Chan , et al. November 19, 2
2013-11-19
LED package
Grant 8,564,003 - Ke , et al. October 22, 2
2013-10-22
Method for distributing phosphor particulates on LED chip
Grant 8,546,158 - Chan , et al. October 1, 2
2013-10-01
LED package
Grant 8,513,698 - Chan , et al. August 20, 2
2013-08-20
LED unit
Grant 8,507,932 - Ke , et al. August 13, 2
2013-08-13
LED unit having self-connecting leads
Grant 8,455,901 - Chan , et al. June 4, 2
2013-06-04
LED module
Grant 8,449,153 - Lo , et al. May 28, 2
2013-05-28
Method for packaging light emitting diode
Grant 8,409,885 - Chan , et al. April 2, 2
2013-04-02
Led Package And Mold Of Manufacturing The Same
App 20130062650 - CHAN; SHIUN-WEI ;   et al.
2013-03-14
LED package, and mold and method of manufacturing the same
Grant 8,318,514 - Chan , et al. November 27, 2
2012-11-27
Led Package
App 20120241790 - KE; CHIH-HSUN ;   et al.
2012-09-27
Led Package, Method For Making The Led Package And Light Source Having The Same
App 20120241789 - CHAN; SHIUN-WEI ;   et al.
2012-09-27
Method for distributing fluorescence onto LED chip
Grant 8,268,652 - Chan , et al. September 18, 2
2012-09-18
Light Emitting Diode Package And Light Emitting Device Having The Same
App 20120217525 - CHAN; SHIUN-WEI ;   et al.
2012-08-30
Led Module
App 20120127742 - LO; HSING-FEN ;   et al.
2012-05-24
Method For Packaging Light Emitting Diode
App 20120107975 - CHAN; SHIUN-WEI ;   et al.
2012-05-03
Led Package
App 20120098005 - CHAN; SHIUN-WEI ;   et al.
2012-04-26
Led Package
App 20120098021 - CHAN; SHIUN-WEI ;   et al.
2012-04-26
Light Emitting Element Package
App 20120098010 - CHAN; SHIUN-WEI ;   et al.
2012-04-26
Light Emitting Diode Package
App 20120098004 - KE; CHIH-HSUN ;   et al.
2012-04-26
Method For Distributing Phosphor Particulates On Led Chip
App 20120100646 - CHAN; SHIUN-WEI ;   et al.
2012-04-26
Light Emitting Diode Package And Method For Manufacturing The Same
App 20120091487 - CHAN; SHIUN-WEI ;   et al.
2012-04-19
Method For Distributing Fluorescence Onto Led Chip
App 20120094404 - CHAN; SHIUN-WEI ;   et al.
2012-04-19
Light Emitting Device
App 20120091485 - CHAN; SHIUN-WEI ;   et al.
2012-04-19
Led Package, And Mold And Method Of Manufacturing The Same
App 20120086031 - CHAN; SHIUN-WEI ;   et al.
2012-04-12
Light Emitting Diode Module
App 20120080696 - CHAN; SHIUN-WEI ;   et al.
2012-04-05
Led Unit Having Self-connecting Leads
App 20120074436 - CHAN; SHIUN-WEI ;   et al.
2012-03-29
Led Unit Having Uniform Light Emission
App 20120074437 - CHAN; SHIUN-WEI ;   et al.
2012-03-29
Light Emitting Device Package And Method Of Manufacturing The Same
App 20120074452 - CHAN; SHIUN-WEI ;   et al.
2012-03-29
Led Unit
App 20120049221 - KE; CHIH-HSUN ;   et al.
2012-03-01
Light Emitting Diode Package And Light Emitting Diode Module
App 20120025258 - CHAN; SHIUN-WEI ;   et al.
2012-02-02
Housing for light emitting diode
Grant D645,830 - Lo , et al. September 27, 2
2011-09-27
Housing for light emitting diode
Grant D645,423 - Lo , et al. September 20, 2
2011-09-20
Housing for light emitting diode
Grant D645,422 - Lo , et al. September 20, 2
2011-09-20

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