CHAN; Sheng-Chin
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHAN; Sheng-Chin.The latest application filed is for "heat dissipating apparatus used in non-forced convection".
- CHAN; Sheng-Chin - Taipei City TW
- Chan; Sheng-Chin - Taipei TW
| Patent | Date |
|---|---|
| Heat Dissipating Apparatus Used In Non-forced Convection App 20210033356 - CHEN; Yi-Chuan ; et al. | 2021-02-04 |
| Heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers Grant 9,593,887 - Yeh , et al. March 14, 2 | 2017-03-14 |
| Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers App 20160298909 - YEH; Yun-Yeu ; et al. | 2016-10-13 |
| Thermoelectric-cooling-chip-based Heat-disspating System App 20160219755 - LAI; Yaw-Huey ; et al. | 2016-07-28 |
| Heat-dissipating Structure App 20160209121 - YEH; Yun-Yeu ; et al. | 2016-07-21 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 