Chan; Michael Y.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chan; Michael Y..The latest application filed is for "conductive micro led architecture for on-wafer testing".
- Chan; Michael Y. - Sunnyvale CA
- Chan; Michael Y. - Mountain View CA US
- Chan; Michael Y. - Portland OR
- Chan; Michael Y. - Houston TX
- Chan, Michael Y. - Oakland CA
- Chan; Michael Y. - Alpharetta GA
- Chan; Michael Y. - Wallingford PA
| Patent | Date |
|---|---|
| Conductive micro LED architecture for on-wafer testing Grant 11,404,601 - John , et al. August 2, 2 | 2022-08-02 |
| Conductive Micro LED Architecture for On-Wafer Testing App 20210091259 - John; Ranjith Samuel E. ; et al. | 2021-03-25 |
| Memory cell that includes a carbon-based memory element and methods of forming the same Grant 8,481,394 - Chan , et al. July 9, 2 | 2013-07-09 |
| Three-dimensional stacked substrate arrangements Grant 8,421,225 - Ramanathan , et al. April 16, 2 | 2013-04-16 |
| Three-dimensional Stacked Substrate Arrangements App 20120280387 - Ramanathan; Shriram ; et al. | 2012-11-08 |
| Three-dimensional stacked substrate arrangements Grant 8,203,208 - Ramanathan , et al. June 19, 2 | 2012-06-19 |
| Three-dimensional Stacked Substrate Arrangements App 20110260319 - Ramanathan; Shriram ; et al. | 2011-10-27 |
| Memory Cell That Includes A Carbon-based Memory Element And Methods Of Forming The Same App 20110215320 - Chan; Michael Y. ; et al. | 2011-09-08 |
| Three-dimensional stacked substrate arrangements Grant 7,973,407 - Ramanathan , et al. July 5, 2 | 2011-07-05 |
| Three-dimensional stacked substrate arrangements App 20090174070 - Ramanathan; Shriram ; et al. | 2009-07-09 |
| Bonded wafer processing method Grant 7,129,172 - Morrow , et al. October 31, 2 | 2006-10-31 |
| Point-to-point electrical loading for a multi-drop bus Grant 7,099,966 - Chan , et al. August 29, 2 | 2006-08-29 |
| Bonded wafer processing method App 20050215056 - Morrow, Patrick ; et al. | 2005-09-29 |
| Three-dimensional stacked substrate arrangements App 20050003650 - Ramanathan, Shriram ; et al. | 2005-01-06 |
| Point-to-point electrical loading for a multi-drop bus App 20040003162 - Chan, Michael Y. ; et al. | 2004-01-01 |
| Towel fold configuration Grant 6,623,833 - Chan September 23, 2 | 2003-09-23 |
| Towel fold configuration App 20020051863 - Chan, Michael Y. | 2002-05-02 |
| Apparatus for controlling the impedance of high speed signals on a printed circuit board Grant 5,986,893 - Leigh , et al. November 16, 1 | 1999-11-16 |
| Apparatus for controlling the impedance of high speed signals on a printed circuit board Grant 5,764,489 - Leigh , et al. June 9, 1 | 1998-06-09 |
| Interleaved towel fold configuration Grant 5,118,554 - Chan , et al. June 2, 1 | 1992-06-02 |
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