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name:-0.031886100769043
name:-0.026302099227905
name:-0.01291298866272
CHAN; Hsun-Wei Patent Filings

CHAN; Hsun-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHAN; Hsun-Wei.The latest application filed is for "optical module and method of making the same".

Company Profile
13.25.30
  • CHAN; Hsun-Wei - Kaohsiung TW
  • Chan; Hsun-Wei - Taoyuan TW
  • Chan; Hsun-Wei - Taoyuan City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Optical Module And Method Of Making The Same
App 20220187068 - CHEN; Ying-Chung ;   et al.
2022-06-16
Interconnection structure and sensor package
Grant 11,296,025 - Chan , et al. April 5, 2
2022-04-05
Semiconductor device package and method for manufacturing the same
Grant 11,276,806 - Chiang , et al. March 15, 2
2022-03-15
Optical device and method of manufacturing the same
Grant 11,276,797 - Tsai , et al. March 15, 2
2022-03-15
Optical module and method of making the same
Grant 11,262,197 - Chen , et al. March 1, 2
2022-03-01
Semiconductor Device Package
App 20210280755 - HO; Hsin-Ying ;   et al.
2021-09-09
Semiconductor Device Package And Method For Manufacturing The Same
App 20210210662 - CHIANG; Yi Wen ;   et al.
2021-07-08
Semiconductor device package and method of manufacturing the same
Grant 10,910,532 - Ho , et al. February 2, 2
2021-02-02
Lid Structure And Semiconductor Device Package Including The Same
App 20210005522 - CHEN; Chun-Han ;   et al.
2021-01-07
Optical device package and method of manufacturing the same
Grant 10,862,014 - Ho , et al. December 8, 2
2020-12-08
Optical Device And Method Of Manufacturing The Same
App 20200328322 - TSAI; Hsiang-Chen ;   et al.
2020-10-15
Lid structure and semiconductor device package including the same
Grant 10,804,173 - Chen , et al. October 13, 2
2020-10-13
Semiconductor device package
Grant 10,752,494 - Tseng , et al. A
2020-08-25
Semiconductor device package including a wall and a grounding ring exposed from the wall
Grant 10,689,249 - Huang , et al.
2020-06-23
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200140262 - HUANG; Ching-Han ;   et al.
2020-05-07
Lid and an optical device package having the same
Grant 10,629,787 - Ho , et al.
2020-04-21
Optical Module And Method Of Making The Same
App 20200080841 - CHEN; Ying-Chung ;   et al.
2020-03-12
Optical Device
App 20200035851 - TSAI; Chang Chin ;   et al.
2020-01-30
Interconnection Structure And Sensor Package
App 20200027834 - CHAN; Hsun-Wei ;   et al.
2020-01-23
Semiconductor device package including cover including tilted inner sidewall
Grant 10,526,200 - Huang , et al. J
2020-01-07
Optical module and method of making the same
Grant 10,508,910 - Chen , et al. Dec
2019-12-17
Lid array panel, package with lid and method of making the same
Grant 10,453,760 - Tsai , et al. Oc
2019-10-22
Active optical component with passive optical component and encapsulant for an optical device and electrical device including the same
Grant 10,436,635 - Chiang , et al. O
2019-10-08
Semiconductor package device and method of manufacturing the same
Grant 10,424,566 - Hsu , et al. Sept
2019-09-24
Optical module, manufacturing method thereof and electronic apparatus
Grant 10,396,783 - Chan A
2019-08-27
Semiconductor package device
Grant 10,381,294 - Chan A
2019-08-13
Semiconductor Device Package
App 20190202686 - TSENG; Chi Sheng ;   et al.
2019-07-04
Semiconductor Device Package And Method Of Manufacturing The Same
App 20190181311 - HO; Hsin-Ying ;   et al.
2019-06-13
LED packages and related methods
Grant 10,177,283 - Chan J
2019-01-08
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20180315894 - HO; Hsin-Ying ;   et al.
2018-11-01
Semiconductor package device and method of manufacturing the same
Grant 10,069,051 - Ho , et al. September 4, 2
2018-09-04
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180190629 - HSU; Chung-Wei ;   et al.
2018-07-05
Semiconductor Device Package And Method Of Manufacturing The Same
App 20180072563 - HUANG; Ching-Han ;   et al.
2018-03-15
Electronic device, lid structure and package structure
Grant 9,881,845 - Chang , et al. January 30, 2
2018-01-30
Semiconductor device package for reducing parasitic light and method of manufacturing the same
Grant 9,850,124 - Huang , et al. December 26, 2
2017-12-26
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20170294560 - HO; Hsin-Ying ;   et al.
2017-10-12
Semiconductor Package Device And Method Of Manufacturing The Same
App 20170294564 - HO; Hsin-Ying ;   et al.
2017-10-12
Lid Array Panel, Package With Lid And Method Of Making The Same
App 20170294361 - TSAI; Chang Chin ;   et al.
2017-10-12
Semiconductor Package Device
App 20170221805 - CHAN; Hsun-Wei
2017-08-03
Led Packages And Related Methods
App 20170222093 - Chan; Hsun-Wei
2017-08-03
Optical Device Package And Method Of Manufacturing The Same
App 20170138566 - HO; Hsin-Ying ;   et al.
2017-05-18
LED packages and related methods
Grant 9,653,656 - Chan May 16, 2
2017-05-16
Semiconductor Device Package And Method Of Manufacturing The Same
App 20170113922 - HUANG; Ching-Han ;   et al.
2017-04-27
Lid Structure And Semiconductor Device Package Including The Same
App 20170110426 - Chen; Chun-Han ;   et al.
2017-04-20
Optical Device, Electrical Device And Passive Optical Component
App 20170082485 - CHIANG; Yi Wen ;   et al.
2017-03-23
Semiconductor Device Package And Method Of Manufacturing The Same
App 20170073221 - Huang; Ching-Han ;   et al.
2017-03-16
Optical Module And Method Of Making The Same
App 20160178366 - CHEN; Ying-Chung ;   et al.
2016-06-23
Optical Module, Manufacturing Method Thereof And Electronic Apparatus
App 20160146639 - CHAN; Hsun-Wei
2016-05-26
Thermally enhanced semiconductor packages and related methods
Grant 8,637,887 - Chan January 28, 2
2014-01-28
Thermally Enhanced Semiconductor Packages And Related Methods
App 20130299960 - Chan; Hsun-Wei
2013-11-14
Led Packages And Related Methods
App 20130242524 - Chan; Hsun-Wei
2013-09-19

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