Patent | Date |
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Optical Module And Method Of Making The Same App 20220187068 - CHEN; Ying-Chung ;   et al. | 2022-06-16 |
Interconnection structure and sensor package Grant 11,296,025 - Chan , et al. April 5, 2 | 2022-04-05 |
Semiconductor device package and method for manufacturing the same Grant 11,276,806 - Chiang , et al. March 15, 2 | 2022-03-15 |
Optical device and method of manufacturing the same Grant 11,276,797 - Tsai , et al. March 15, 2 | 2022-03-15 |
Optical module and method of making the same Grant 11,262,197 - Chen , et al. March 1, 2 | 2022-03-01 |
Semiconductor Device Package App 20210280755 - HO; Hsin-Ying ;   et al. | 2021-09-09 |
Semiconductor Device Package And Method For Manufacturing The Same App 20210210662 - CHIANG; Yi Wen ;   et al. | 2021-07-08 |
Semiconductor device package and method of manufacturing the same Grant 10,910,532 - Ho , et al. February 2, 2 | 2021-02-02 |
Lid Structure And Semiconductor Device Package Including The Same App 20210005522 - CHEN; Chun-Han ;   et al. | 2021-01-07 |
Optical device package and method of manufacturing the same Grant 10,862,014 - Ho , et al. December 8, 2 | 2020-12-08 |
Optical Device And Method Of Manufacturing The Same App 20200328322 - TSAI; Hsiang-Chen ;   et al. | 2020-10-15 |
Lid structure and semiconductor device package including the same Grant 10,804,173 - Chen , et al. October 13, 2 | 2020-10-13 |
Semiconductor device package Grant 10,752,494 - Tseng , et al. A | 2020-08-25 |
Semiconductor device package including a wall and a grounding ring exposed from the wall Grant 10,689,249 - Huang , et al. | 2020-06-23 |
Semiconductor Device Package And Method Of Manufacturing The Same App 20200140262 - HUANG; Ching-Han ;   et al. | 2020-05-07 |
Lid and an optical device package having the same Grant 10,629,787 - Ho , et al. | 2020-04-21 |
Optical Module And Method Of Making The Same App 20200080841 - CHEN; Ying-Chung ;   et al. | 2020-03-12 |
Optical Device App 20200035851 - TSAI; Chang Chin ;   et al. | 2020-01-30 |
Interconnection Structure And Sensor Package App 20200027834 - CHAN; Hsun-Wei ;   et al. | 2020-01-23 |
Semiconductor device package including cover including tilted inner sidewall Grant 10,526,200 - Huang , et al. J | 2020-01-07 |
Optical module and method of making the same Grant 10,508,910 - Chen , et al. Dec | 2019-12-17 |
Lid array panel, package with lid and method of making the same Grant 10,453,760 - Tsai , et al. Oc | 2019-10-22 |
Active optical component with passive optical component and encapsulant for an optical device and electrical device including the same Grant 10,436,635 - Chiang , et al. O | 2019-10-08 |
Semiconductor package device and method of manufacturing the same Grant 10,424,566 - Hsu , et al. Sept | 2019-09-24 |
Optical module, manufacturing method thereof and electronic apparatus Grant 10,396,783 - Chan A | 2019-08-27 |
Semiconductor package device Grant 10,381,294 - Chan A | 2019-08-13 |
Semiconductor Device Package App 20190202686 - TSENG; Chi Sheng ;   et al. | 2019-07-04 |
Semiconductor Device Package And Method Of Manufacturing The Same App 20190181311 - HO; Hsin-Ying ;   et al. | 2019-06-13 |
LED packages and related methods Grant 10,177,283 - Chan J | 2019-01-08 |
Semiconductor Device Package And A Method Of Manufacturing The Same App 20180315894 - HO; Hsin-Ying ;   et al. | 2018-11-01 |
Semiconductor package device and method of manufacturing the same Grant 10,069,051 - Ho , et al. September 4, 2 | 2018-09-04 |
Semiconductor Package Device And Method Of Manufacturing The Same App 20180190629 - HSU; Chung-Wei ;   et al. | 2018-07-05 |
Semiconductor Device Package And Method Of Manufacturing The Same App 20180072563 - HUANG; Ching-Han ;   et al. | 2018-03-15 |
Electronic device, lid structure and package structure Grant 9,881,845 - Chang , et al. January 30, 2 | 2018-01-30 |
Semiconductor device package for reducing parasitic light and method of manufacturing the same Grant 9,850,124 - Huang , et al. December 26, 2 | 2017-12-26 |
Semiconductor Device Package And A Method Of Manufacturing The Same App 20170294560 - HO; Hsin-Ying ;   et al. | 2017-10-12 |
Semiconductor Package Device And Method Of Manufacturing The Same App 20170294564 - HO; Hsin-Ying ;   et al. | 2017-10-12 |
Lid Array Panel, Package With Lid And Method Of Making The Same App 20170294361 - TSAI; Chang Chin ;   et al. | 2017-10-12 |
Semiconductor Package Device App 20170221805 - CHAN; Hsun-Wei | 2017-08-03 |
Led Packages And Related Methods App 20170222093 - Chan; Hsun-Wei | 2017-08-03 |
Optical Device Package And Method Of Manufacturing The Same App 20170138566 - HO; Hsin-Ying ;   et al. | 2017-05-18 |
LED packages and related methods Grant 9,653,656 - Chan May 16, 2 | 2017-05-16 |
Semiconductor Device Package And Method Of Manufacturing The Same App 20170113922 - HUANG; Ching-Han ;   et al. | 2017-04-27 |
Lid Structure And Semiconductor Device Package Including The Same App 20170110426 - Chen; Chun-Han ;   et al. | 2017-04-20 |
Optical Device, Electrical Device And Passive Optical Component App 20170082485 - CHIANG; Yi Wen ;   et al. | 2017-03-23 |
Semiconductor Device Package And Method Of Manufacturing The Same App 20170073221 - Huang; Ching-Han ;   et al. | 2017-03-16 |
Optical Module And Method Of Making The Same App 20160178366 - CHEN; Ying-Chung ;   et al. | 2016-06-23 |
Optical Module, Manufacturing Method Thereof And Electronic Apparatus App 20160146639 - CHAN; Hsun-Wei | 2016-05-26 |
Thermally enhanced semiconductor packages and related methods Grant 8,637,887 - Chan January 28, 2 | 2014-01-28 |
Thermally Enhanced Semiconductor Packages And Related Methods App 20130299960 - Chan; Hsun-Wei | 2013-11-14 |
Led Packages And Related Methods App 20130242524 - Chan; Hsun-Wei | 2013-09-19 |