Chan; Clayton Ka Tsun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Clayton Ka Tsun.The latest application filed is for "led with internally confined current injection area".

Company Profile

2.10.11

Chan; Clayton Ka Tsun - Fremont CA
Chan; Clayton Ka Tsun - San Jose CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Led With Internally Confined Current Injection Area App 20220013688 - McGroddy; Kelly ; et al.	2022-01-13
LED with internally confined current injection area Grant 11,101,405 - McGroddy , et al. August 24, 2	2021-08-24
Led With Internally Confined Current Injection Area App 20200251614 - Kind Code	2020-08-06
LED with internally confined current injection area Grant 10,593,832 - McGroddy , et al.	2020-03-17
Surface modification process for laser application Grant 9,966,260 - Chan , et al. May 8, 2	2018-05-08
Etch removal of current distribution layer for LED current confinement Grant 9,583,466 - McGroddy , et al. February 28, 2	2017-02-28
Led With Internally Confined Current Injection Area App 20160336484 - McGroddy; Kelly ; et al.	2016-11-17
LED with internally confined current injection area Grant 9,450,147 - McGroddy , et al. September 20, 2	2016-09-20
Micro Led With Dielectric Side Mirror App 20160181476 - Chang; Kevin K. C. ; et al.	2016-06-23
Adhesive wafer bonding with sacrificial spacers for controlled thickness variation Grant 9,153,548 - Chan , et al. October 6, 2	2015-10-06
Adhesive wafer bonding with controlled thickness variation Grant 9,087,764 - Chan , et al. July 21, 2	2015-07-21
Etch Removal Of Current Distribution Layer For Led Current Confinement App 20150187740 - McGroddy; Kelly ; et al.	2015-07-02
Led With Internally Confined Current Injection Area App 20150187991 - McGroddy; Kelly ; et al.	2015-07-02
Adhesive Wafer Bonding With Sacrificial Spacers For Controlled Thickness Variation App 20150076528 - Chan; Clayton Ka Tsun ; et al.	2015-03-19
Illumination devices and methods of fabrication thereof Grant 8,979,349 - Bita , et al. March 17, 2	2015-03-17
Adhesive Wafer Bonding With Controlled Thickness Variation App 20150028362 - Chan; Clayton Ka Tsun ; et al.	2015-01-29
Periscoping vanes for smart windows Grant 8,325,409 - Sethuraman , et al. December 4, 2	2012-12-04
Illumination Devices And Methods Of Fabrication Thereof App 20100302803 - Bita; Ion ; et al.	2010-12-02
Illumination Devices And Methods Of Fabrication Thereof App 20100302218 - Bita; Ion ; et al.	2010-12-02
Illumination Devices And Methods Of Fabrication Thereof App 20100302616 - Bita; Ion ; et al.	2010-12-02

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