Chan; Chingho Philip
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chan; Chingho Philip.The latest application filed is for "under-bump metallization layers and electroplated solder bumping technology for flip-chip".
- Chan; Chingho Philip - Kowloon HK
| Patent | Date |
|---|---|
| Under-bump metallization layers and electroplated solder bumping technology for flip-chip Grant 7,199,036 - Chan , et al. April 3, 2 | 2007-04-03 |
| Stencil mask design method and under bump metallurgy for C4 solder bump Grant 7,135,355 - Chan , et al. November 14, 2 | 2006-11-14 |
| Stencil mask design method and under bump metallurgy for C4 solder bump App 20050014310 - Chan, Chingho Philip ; et al. | 2005-01-20 |
| Under-bump metallization layers and electroplated solder bumping technology for flip-chip App 20050014355 - Chan, Chingho Philip ; et al. | 2005-01-20 |
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