Chan; Chien-Pin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Chien-Pin.The latest application filed is for "bump structure and method of making the same".

Company Profile

3.7.7

Chan; Chien-Pin - Pingzhen TW
CHAN; Chien-Pin - Pingzhen City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bump structure and method of making the same Grant 11,417,539 - Lu , et al. August 16, 2	2022-08-16
Bump Structure And Method Of Making The Same App 20210272819 - LU; Wen-Hsiung ; et al.	2021-09-02
Conductive External Connector Structure and Method of Forming App 20200373267 - Shih; Meng-Fu ; et al.	2020-11-26
Conductive external connector structure and method of forming Grant 10,741,513 - Shih , et al. A	2020-08-11
Conductive External Connector Structure and Method of Forming App 20190131263 - Shih; Meng-Fu ; et al.	2019-05-02
Conductive external connector structure and method of forming Grant 10,163,836 - Shih , et al. Dec	2018-12-25
Conductive External Connector Structure and Method of Forming App 20180166409 - Shih; Meng-Fu ; et al.	2018-06-14
Conductive external connector structure and method of forming Grant 9,875,979 - Shih , et al. January 23, 2	2018-01-23
Conductive External Connector Structure and Method of Forming App 20170141059 - Shih; Meng-Fu ; et al.	2017-05-18
Semiconductor device and semiconductor assembly with lead-free solder Grant 8,952,534 - Lai , et al. February 10, 2	2015-02-10
Semiconductor Device And Semiconductor Assembly With Lead-free Solder App 20140070409 - LAI; Yi-Jen ; et al.	2014-03-13
Semiconductor device and semiconductor assembly with lead-free solder Grant 8,610,270 - Lai , et al. December 17, 2	2013-12-17
Semiconductor Device And Semiconductor Assembly With Lead-free Solder App 20110193219 - LAI; Yi-Jen ; et al.	2011-08-11

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