Chan; Chi Fung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Chi Fung.The latest application filed is for "laser leveling tool with gesture control".

Company Profile

0.7.8

Chan; Chi Fung - North Point HK
Chan; Chi Fung - Tsuen Wan HK
Chan; Chi Fung - Lai King N/A CN
Chan; Chi Fung - Hong Kong N/A CN
Chan; Chi Fung - Kwai Chung CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser Leveling Tool with Gesture Control App 20210341287 - Chan; Chi Fung ; et al.	2021-11-04
Laser Leveling Tool with Improved Laser Pattern Projection App 20210325184 - Chan; Chi Fung ; et al.	2021-10-21
Apparatus and method for adjustment of a handling device for handling electronic components Grant 10,115,620 - Cheung , et al. October 30, 2	2018-10-30
Apparatus And Method For Adjustment Of A Handling Device For Handling Electronic Components App 20170062256 - CHEUNG; Yu Sze ; et al.	2017-03-02
Method for link buffer size and queue length estimation for bandwidth-varying mobile data networks Grant 8,923,270 - Lee , et al. December 30, 2	2014-12-30
Flip arm module for a bonding apparatus incorporating changeable collet tools Grant 8,857,486 - Chan , et al. October 14, 2	2014-10-14
Method For Link Buffer Size And Queue Length Estimation For Bandwidth-varying Mobile Data Networks App 20130083654 - LEE; Yiu Bun Jack ; et al.	2013-04-04
Flip Arm Module For A Bonding Apparatus Incorporating Changeable Collet Tools App 20120279660 - CHAN; Chi Fung ; et al.	2012-11-08
Apparatus and method of placing solder balls onto a substrate Grant 6,766,938 - Cheng , et al. July 27, 2	2004-07-27
Apparatus and method for ball release Grant 6,607,118 - Cheng , et al. August 19, 2	2003-08-19
Apparatus and method of placing solder balls onto a substrate App 20030127501 - Cheng, Chi Wah ; et al.	2003-07-10
Apparatus and method for ball release App 20020158108 - Cheng, Chi Wah ; et al.	2002-10-31

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