Chan; Benson

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chan; Benson.The latest application filed is for "bidirectional ac-dc converter with multilevel power factor correction".

Company Profile

1.47.37

Chan; Benson - Vestal NY
Chan; Benson - Mooresville NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bidirectional AC-DC Converter With Multilevel Power Factor Correction App 20220109381 - Yenduri; Kalyan ; et al.	2022-04-07
Electrically conductive adhesive (ECA) for multilayer device interconnects Grant 9,451,693 - Das , et al. September 20, 2	2016-09-20
Human being tracking and monitoring system Grant 9,007,202 - Chan , et al. April 14, 2	2015-04-14
Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same Grant 8,502,082 - Chan , et al. August 6, 2	2013-08-06
Electrically Conductive Adhesive (eca) For Multilayer Device Interconnects App 20130033827 - Das; Rabindra N. ; et al.	2013-02-07
Modular, Detachable Compute Leaf For Use With Computing System App 20120260063 - Markovich; Voya R. ; et al.	2012-10-11
Method of applying force to electrical contacts on a printed circuit board Grant 8,196,281 - Chan , et al. June 12, 2	2012-06-12
Sampling sufficiency testing Grant 8,069,012 - Chan , et al. November 29, 2	2011-11-29
Spring actuated clamping mechanism Grant 8,028,390 - Chan , et al. October 4, 2	2011-10-04
Spring Actuated Clamping Mechanism App 20110197430 - Chan; Benson ; et al.	2011-08-18
High density connector for interconnecting fine pitch circuit packaging structures Grant 7,972,178 - Chan , et al. July 5, 2	2011-07-05
High Density Connector For Interconnecting Fine Pitch Circuit Packaging Structures App 20100323558 - Chan; Benson ; et al.	2010-12-23
LED lighting assembly and lamp utilizing same Grant 7,841,741 - Chan , et al. November 30, 2	2010-11-30
Circuitized substrate with internal cooling structure and electrical assembly utilizing same Grant 7,738,249 - Chan , et al. June 15, 2	2010-06-15
Method of making circuitized substrate with internal optical pathway using photolithography Grant 7,713,767 - Chan , et al. May 11, 2	2010-05-11
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same Grant 7,679,005 - Chan , et al. March 16, 2	2010-03-16
Spring actuated clamping mechanism App 20090320280 - Chan; Benson ; et al.	2009-12-31
Sampling Sufficiency Testing App 20090306933 - Chan; Benson ; et al.	2009-12-10
Method and system for tracking goods Grant 7,552,091 - Chan , et al. June 23, 2	2009-06-23
Method of making circuitized substrate with internal optical pathway Grant 7,541,058 - Chan , et al. June 2, 2	2009-06-02
Circuitized substrate with internal cooling structure and electrical assembly utilizing same App 20090109624 - Chan; Benson ; et al.	2009-04-30
Method of making circuitized substrate with internal optical pathway App 20090092353 - Chan; Benson ; et al.	2009-04-09
Method of making circuitized substrate with internal optical pathway using photolithography App 20090093073 - Chan; Benson ; et al.	2009-04-09
Interposer and test assembly for testing electronic devices Grant 7,501,839 - Chan , et al. March 10, 2	2009-03-10
Electronic card assembly Grant 7,441,709 - Chan , et al. October 28, 2	2008-10-28
LED lighting assembly and lamp utilizing same App 20080238323 - Chan; Benson ; et al.	2008-10-02
Non-oriented wire in elastomer electrical contact Grant 7,252,515 - Brodsky , et al. August 7, 2	2007-08-07
Non-oriented wire in elastomer electrical contact App 20070111558 - Brodsky; William L. ; et al.	2007-05-17
Non-oriented wire in elastomer electrical contact Grant 7,204,697 - Brodsky , et al. April 17, 2	2007-04-17
Interposer and test assembly for testing electronic devices App 20070075726 - Chan; Benson ; et al.	2007-04-05
Method of making high speed circuit board Grant 7,152,319 - Chan , et al. December 26, 2	2006-12-26
Radio frequency device for tracking goods Grant 7,142,121 - Chan , et al. November 28, 2	2006-11-28
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same App 20060214010 - Chan; Benson ; et al.	2006-09-28
Electronic card assembly App 20060213973 - Chan; Benson ; et al.	2006-09-28
Optical coupler replication arrangement and process Grant 7,108,809 - Chan , et al. September 19, 2	2006-09-19
Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same App 20060180343 - Chan; Benson ; et al.	2006-08-17
Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components App 20060121722 - Card; Norman A. ; et al.	2006-06-08
Non-oriented wire in elastomer electrical contact App 20060057867 - Brodsky; William L. ; et al.	2006-03-16
High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same Grant 6,995,322 - Chan , et al. February 7, 2	2006-02-07
Non-oriented wire in elastomer electrical contact Grant 6,981,880 - Brodsky , et al. January 3, 2	2006-01-03
Method and system for tracking goods App 20050289019 - Chan, Benson ; et al.	2005-12-29
Non-oriented Wire In Elastomer Electrical Contact App 20050282409 - Brodsky, William L. ; et al.	2005-12-22
Printed wiring board interposer sub-assembly and method Grant 6,974,915 - Brodsky , et al. December 13, 2	2005-12-13
Radio frequency device for tracking goods App 20050270160 - Chan, Benson ; et al.	2005-12-08
Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same Grant 6,964,884 - Chan , et al. November 15, 2	2005-11-15
Method of making an interposer sub-assembly in a printed wiring board Grant 6,892,451 - Brodsky , et al. May 17, 2	2005-05-17
Method of making an interposer sub-assembly in a printed wiring board App 20050064740 - Brodsky, William Louis ; et al.	2005-03-24
High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same App 20050039950 - Chan, Benson ; et al.	2005-02-24
Electrical coupling of substrates by conductive buttons Grant 6,848,914 - Beaman , et al. February 1, 2	2005-02-01
High speed circuit board and method for fabrication Grant 6,828,514 - Chan , et al. December 7, 2	2004-12-07
High speed circuit board and method for fabrication App 20040231888 - Chan, Benson ; et al.	2004-11-25
Assembly of opto-electronic module with improved heat sink Grant 6,822,875 - Chan , et al. November 23, 2	2004-11-23
High speed circuit board and method for fabrication App 20040150969 - Chan, Benson ; et al.	2004-08-05
Optical device with chip level precision alignment Grant 6,741,778 - Chan , et al. May 25, 2	2004-05-25
Optical coupler replication arrangement and process App 20040061248 - Chan, Benson ; et al.	2004-04-01
Fiber optic connections and method for using same Grant 6,712,527 - Chan , et al. March 30, 2	2004-03-30
Land grid array connector and method for forming the same Grant 6,679,707 - Brodsky , et al. January 20, 2	2004-01-20
Enhanced optical coupler Grant 6,676,301 - Chan , et al. January 13, 2	2004-01-13
Enhanced optical transceiver arrangement Grant 6,652,159 - Chan , et al. November 25, 2	2003-11-25
Stacked optical coupler Grant 6,644,864 - Chan , et al. November 11, 2	2003-11-11
Multi-functional fiber optic coupler Grant 6,635,866 - Chan , et al. October 21, 2	2003-10-21
Stacked Optical Coupler App 20030174970 - Chan, Benson ; et al.	2003-09-18
Method of making an interposer sub-assembly in a printed wiring board App 20030116351 - Brodsky, William Louis ; et al.	2003-06-26
Electrical coupling of substrates by conductive buttons App 20030073329 - Beaman, Brian S. ; et al.	2003-04-17
Printed wiring board interposer sub-assembly Grant 6,545,226 - Brodsky , et al. April 8, 2	2003-04-08
Assembly of opto-electronic module with improved heat sink App 20030059176 - Chan, Benson ; et al.	2003-03-27
Optical fiber guide module and a method for making the same Grant 6,527,457 - Chan , et al. March 4, 2	2003-03-04
Assembly of opto-electronic module with improved heat sink Grant 6,508,595 - Chan , et al. January 21, 2	2003-01-21
Processing Protective Plug Insert For Optical Modules App 20030002837 - Chan, Benson ; et al.	2003-01-02
Enhanced optical transceiver arrangement App 20030002824 - Chan, Benson ; et al.	2003-01-02
Enhanced optical coupler App 20030002819 - Chan, Benson ; et al.	2003-01-02
Printed wiring board interposer sub-assembly and method App 20020179331 - Brodsky, William Louis ; et al.	2002-12-05
Multi-functional fiber optic coupler App 20020154869 - Chan, Benson ; et al.	2002-10-24
Optical fiber guide module and a method for making the same App 20020102072 - Chan, Benson ; et al.	2002-08-01
Printed circuit board to module mounting and interconnecting structure and method Grant 6,386,890 - Bhatt , et al. May 14, 2	2002-05-14
Compliant, surface-mountable interposer Grant 6,224,396 - Chan , et al. May 1, 2	2001-05-01
Surface mount socket Grant 6,015,301 - Brodsky , et al. January 18, 2	2000-01-18
Computer system with surface mount socket Grant 5,785,535 - Brodsky , et al. July 28, 1	1998-07-28
Method and system for testing an electronic module mounted on a printed circuit board Grant 5,764,071 - Chan , et al. June 9, 1	1998-06-09
Method and apparatus for locating electrical circuit members Grant 5,730,620 - Chan , et al. March 24, 1	1998-03-24
Electronic package assembly and connector for use therewith Grant 5,468,996 - Chan , et al. November 21, 1	1995-11-21

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