| Patent | Date |
|---|
Selective dielectric resin application on circuitized core layers
Grant 11,178,757 - Chamberlin , et al. November 16, 2 | 2021-11-16 |
Non-destructive identifying of plating dissolution in soldered, plated through-hole
Grant 11,059,120 - Kelly , et al. July 13, 2 | 2021-07-13 |
Glass-free dielectric layers for printed circuit boards
Grant 10,982,060 - Kuczynski , et al. April 20, 2 | 2021-04-20 |
Manufacturing a product using a soldering process
Grant 10,959,339 - Chamberlin , et al. March 23, 2 | 2021-03-23 |
Glass fiber coatings for improved resistance to conductive anodic filament formation
Grant 10,932,363 - Chamberlin , et al. February 23, 2 | 2021-02-23 |
Glass cloth including attached fibers
Grant 10,801,137 - Chamberlin , et al. October 13, 2 | 2020-10-13 |
In-situ detection of glass fiber defects
Grant 10,684,220 - Campbell , et al. | 2020-06-16 |
Non-destructive Identifying Of Plating Dissolution In Soldered, Plated Through-hole
App 20200139466 - KELLY; Matthew S. ; et al. | 2020-05-07 |
Liquid immersion techniques for improved resistance to conductive anodic filament formation
Grant 10,590,037 - Chamberlin , et al. | 2020-03-17 |
In-situ detection of hollow glass fiber formation
Grant 10,578,551 - Campbell , et al. | 2020-03-03 |
Glass Fiber Coatings For Improved Resistance To Conductive Anodic Filament Formation
App 20190364659 - Chamberlin; Bruce J. ; et al. | 2019-11-28 |
Coating for limiting substrate damage due to discrete failure
Grant 10,492,289 - Chamberlin , et al. Nov | 2019-11-26 |
Selective Dielectric Resin Application On Circuitized Core Layers
App 20190342994 - CHAMBERLIN; BRUCE J. ; et al. | 2019-11-07 |
Selective Dielectric Resin Application On Circuitized Core Layers
App 20190342995 - CHAMBERLIN; BRUCE J. ; et al. | 2019-11-07 |
Coating for limiting substrate damage due to discrete failure
Grant 10,470,290 - Chamberlin , et al. No | 2019-11-05 |
Glass fiber coatings for improved resistance to conductive anodic filament formation
Grant 10,462,900 - Chamberlin , et al. Oc | 2019-10-29 |
Selective dielectric resin application on circuitized core layers
Grant 10,405,421 - Chamberlin , et al. Sep | 2019-09-03 |
Glass-free Dielectric Layers For Printed Circuit Boards
App 20190248970 - KUCZYNSKI; JOSEPH ; et al. | 2019-08-15 |
Interface for limiting substrate damage due to discrete failure
Grant 10,342,122 - Chamberlin , et al. | 2019-07-02 |
Selective Dielectric Resin Application On Circuitized Core Layers
App 20190191558 - CHAMBERLIN; BRUCE J. ; et al. | 2019-06-20 |
Selective Dielectric Resin Application On Circuitized Core Layers
App 20190191559 - CHAMBERLIN; BRUCE J. ; et al. | 2019-06-20 |
Minimizing Printed Circuit Board Warpage
App 20190141841 - Chamberlin; Bruce J. ; et al. | 2019-05-09 |
Minimizing printed circuit board warpage
Grant 10,194,537 - Chamberlin , et al. Ja | 2019-01-29 |
Printed circuit board and methods to enhance reliability
Grant 10,172,243 - Chamberlin , et al. J | 2019-01-01 |
Method for embedding a discrete electrical device in a printed circuit board
Grant 10,149,388 - Chamberlin , et al. De | 2018-12-04 |
Interface for Limiting Substrate Damage Due to Discrete Failure
App 20180332701 - Chamberlin; Bruce J. ; et al. | 2018-11-15 |
Interface for Limiting Substrate Damage Due to Discrete Failure
App 20180324945 - Chamberlin; Bruce J. ; et al. | 2018-11-08 |
Solder for Limiting Substrate Damage Due to Discrete Failure
App 20180318969 - Chamberlin; Bruce J. ; et al. | 2018-11-08 |
Coating for Limiting Substrate Damage Due to Discrete Failure
App 20180324944 - Chamberlin; Bruce J. ; et al. | 2018-11-08 |
Coating for Limiting Substrate Damage Due to Discrete Failure
App 20180324946 - Chamberlin; Bruce J. ; et al. | 2018-11-08 |
Solder for Limiting Substrate Damage Due to Discrete Failure
App 20180318968 - Chamberlin; Bruce J. ; et al. | 2018-11-08 |
Liquid Immersion Techniques For Improved Resistance To Conductive Anodic Filament Formation
App 20180273426 - CHAMBERLIN; BRUCE J. ; et al. | 2018-09-27 |
Interface for limiting substrate damage due to discrete failure
Grant 10,080,283 - Chamberlin , et al. September 18, 2 | 2018-09-18 |
Manufacturing a product using a soldering process
Grant 10,010,000 - Chamberlin , et al. June 26, 2 | 2018-06-26 |
Glass Fiber Coatings For Improved Resistance To Conductive Anodic Filament Formation
App 20180153042 - CHAMBERLIN; BRUCE J. ; et al. | 2018-05-31 |
Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same
Grant 9,986,637 - Chamberlin , et al. May 29, 2 | 2018-05-29 |
Manufacturing A Product Using A Soldering Process
App 20180139851 - CHAMBERLIN; Bruce J. ; et al. | 2018-05-17 |
Printed Circuit Board And Methods To Enhance Reliability
App 20180139852 - CHAMBERLIN; Bruce J. ; et al. | 2018-05-17 |
In-situ Detection Of Hollow Glass Fiber Formation
App 20180106718 - CAMPBELL; ERIC J. ; et al. | 2018-04-19 |
In-situ Detection Of Hollow Glass Fiber Formation
App 20180106719 - CAMPBELL; ERIC J. ; et al. | 2018-04-19 |
Glass Cloth Including Attached Fibers
App 20180023225 - Chamberlin; Bruce J. ; et al. | 2018-01-25 |
In-situ detection of hollow glass fiber formation
Grant 9,863,875 - Campbell , et al. January 9, 2 | 2018-01-09 |
Embedding a discrete electrical device in a printed circuit board
Grant 9,839,131 - Chamberlin , et al. December 5, 2 | 2017-12-05 |
Embedding A Discrete Electrical Device In A Printed Circuit Board
App 20170118842 - CHAMBERLIN; Bruce J. ; et al. | 2017-04-27 |
Embedding A Discrete Electrical Device In A Printed Circuit Board
App 20170118844 - CHAMBERLIN; Bruce J. ; et al. | 2017-04-27 |
SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC CONSTANT (Dk) CORES FOR USE IN PRINTED CIRCUIT BOARDS (PCBs), AND METHOD OF MAKING SAME
App 20160330834 - Chamberlin; Bruce J. ; et al. | 2016-11-10 |
Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same
Grant 9,456,496 - Chamberlin , et al. September 27, 2 | 2016-09-27 |
Manufacturing A Product Using A Soldering Process
App 20160270240 - CHAMBERLIN; Bruce J. ; et al. | 2016-09-15 |
SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC CONSTANT (Dk) CORES FOR USE IN PRINTED CIRCUIT BOARDS (PCBs), AND METHOD OF MAKING SAME
App 20160242280 - Chamberlin; Bruce J. ; et al. | 2016-08-18 |
Manufacturing a product using a soldering process
Grant 9,398,702 - Chamberlin , et al. July 19, 2 | 2016-07-19 |
Manufacturing A Product Using A Soldering Process
App 20140345123 - Chamberlin; Bruce J. ; et al. | 2014-11-27 |
Minimizing Printed Circuit Board Warpage
App 20140285979 - Chamberlin; Bruce J. ; et al. | 2014-09-25 |
Heat sink
Grant 7,856,341 - Carlson , et al. December 21, 2 | 2010-12-21 |
Sandwiched organic LGA structure
Grant 7,795,724 - Brodsky , et al. September 14, 2 | 2010-09-14 |
Circuit on a printed circuit board
Grant 7,742,315 - Becker , et al. June 22, 2 | 2010-06-22 |
Thermal pillow
Grant 7,709,951 - Brodsky , et al. May 4, 2 | 2010-05-04 |
Heat Sink Method, System, And Program Product
App 20090210190 - Carlson; Brian L. ; et al. | 2009-08-20 |
Sandwiched Organic Lga Structure
App 20090057865 - Brodsky; William L. ; et al. | 2009-03-05 |
Thermal Pillow
App 20080225484 - Brodsky; William L. ; et al. | 2008-09-18 |
Selective Surface Roughness For High Speed Signaling
App 20080142249 - Chamberlin; Bruce J. ; et al. | 2008-06-19 |
Printed circuit board and chip module
Grant 7,355,125 - Becker , et al. April 8, 2 | 2008-04-08 |
Temperature dependent semiconductor module connectors
Grant 7,255,571 - Brodsky , et al. August 14, 2 | 2007-08-14 |
Printed circuit board and chip module
App 20070109726 - Becker; Wiren D. ; et al. | 2007-05-17 |
Circuit on a printed circuit board
App 20070111576 - Becker; Wiren D. ; et al. | 2007-05-17 |
Temperature dependent semiconductor module connectors
App 20070010111 - Brodsky; William L. ; et al. | 2007-01-11 |
Temperature dependent semiconductor module connectors
Grant 7,137,826 - Brodsky , et al. November 21, 2 | 2006-11-21 |
Hook interconnect
Grant 7,128,579 - Brodsky , et al. October 31, 2 | 2006-10-31 |
Apparatus and method for PCB smoke and burn detection and prevention
Grant 7,109,722 - Chamberlin , et al. September 19, 2 | 2006-09-19 |
Temperature Dependent Semiconductor Module Connectors
App 20060205273 - Brodsky; William L. ; et al. | 2006-09-14 |
Apparatus and method for PCB smoke and burn detection and prevention
App 20050275552 - Chamberlin, Bruce J. ; et al. | 2005-12-15 |
High performance dense wire for printed circuit board
Grant 6,894,228 - Anstrom , et al. May 17, 2 | 2005-05-17 |
Method for forming a substructure of a multilayered laminate
Grant 6,832,436 - Anstrom , et al. December 21, 2 | 2004-12-21 |
High performance dense wire for printed circuit board
App 20030006857 - Anstrom, Donald O. ; et al. | 2003-01-09 |
High performance dense wire for printed circuit board
Grant 6,495,772 - Anstrom , et al. December 17, 2 | 2002-12-17 |
Land grid array (LGA) pad repair structure and method
App 20020166696 - Chamberlin, Bruce J. ; et al. | 2002-11-14 |
High Performance Dense Wire For Printed Circuit Board
App 20020148637 - Anstrom, Donald O. ; et al. | 2002-10-17 |
Conductive substructures of a multilayered laminate
App 20020100613 - Anstrom, Donald O. ; et al. | 2002-08-01 |
Peripheral power board structure
Grant 6,426,466 - Chamberlin , et al. July 30, 2 | 2002-07-30 |
Conductive substructures of a multilayered laminate
Grant 6,407,341 - Anstrom , et al. June 18, 2 | 2002-06-18 |
Thermal/electrical break for printed circuit boards
Grant 6,235,994 - Chamberlin , et al. May 22, 2 | 2001-05-22 |
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