loadpatents
name:-0.012381076812744
name:-0.0084869861602783
name:-0.00045919418334961
Chamberlain; Jeffrey P. Patent Filings

Chamberlain; Jeffrey P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chamberlain; Jeffrey P..The latest application filed is for "silicon oxide polishing method utilizing colloidal silica".

Company Profile
0.7.9
  • Chamberlain; Jeffrey P. - Aurora IL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silicon oxide polishing method utilizing colloidal silica
App 20080220610 - Bayer; Benjamin ;   et al.
2008-09-11
Rate-enhanced CMP compositions for dielectric films
App 20080020680 - Vacassy; Robert ;   et al.
2008-01-24
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
Grant 7,306,637 - Cherian , et al. December 11, 2
2007-12-11
CMP compositions for low-k dielectric materials
Grant 6,974,777 - Moeggenborg , et al. December 13, 2
2005-12-13
CMP method utilizing amphiphilic nonionic surfactants
Grant 6,936,543 - Schroeder , et al. August 30, 2
2005-08-30
System for the preferential removal of silicon oxide
App 20050072524 - Mueller, Brian L. ;   et al.
2005-04-07
Method for copper CMP using polymeric complexing agents
Grant 6,821,897 - Schroeder , et al. November 23, 2
2004-11-23
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
App 20040229552 - Cherian, Isaac K. ;   et al.
2004-11-18
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
Grant 6,776,810 - Cherian , et al. August 17, 2
2004-08-17
Preequilibrium polishing method and system
Grant 6,726,534 - Bogush , et al. April 27, 2
2004-04-27
CMP compositions for low-k dielectric materials
App 20030228762 - Moeggenborg, Kevin J. ;   et al.
2003-12-11
CMP method utilizing amphiphilic nonionic surfactants
App 20030228763 - Schroeder, David J. ;   et al.
2003-12-11
Alkali metal-containing polishing system and method
Grant 6,612,911 - Carter , et al. September 2, 2
2003-09-02
Method for copper CMP using polymeric complexing agents
App 20030124959 - Schroeder, David J. ;   et al.
2003-07-03
Alkali metal-containing polishing system and method
App 20030082998 - Carter, Phillip ;   et al.
2003-05-01
Integrated chemical-mechanical polishing
App 20010037821 - Staley, Bradley J. ;   et al.
2001-11-08

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