Chalupa; Radek P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chalupa; Radek P..The latest application filed is for "methods of forming substrate interconnect structures for enhanced thin seed conduction".
- Chalupa; Radek P. - Portland OR
- Chalupa; Radek P. - Hillsboro OR
| Patent | Date |
|---|---|
| Methods Of Forming Substrate Interconnect Structures For Enhanced Thin Seed Conduction App 20200402921 - Jezewski; Christopher J. ; et al. | 2020-12-24 |
| Ultrasonic electropolishing of conductive material App 20080213995 - Andryushchenko; Tatyana N. ; et al. | 2008-09-04 |
| Apparatus having plating solution container with current applying anodes Grant 7,279,084 - Chalupa , et al. October 9, 2 | 2007-10-09 |
| Apparatus having plating solution container with current applying anodes App 20050173241 - Chalupa, Radek P. ; et al. | 2005-08-11 |
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