Chai; Songgang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chai; Songgang.The latest application filed is for "thermosetting resin composition, prepreg containing same, laminated board, and printed circuit board".
- Chai; Songgang - Dongguan CN
- Chai; Songgang - Guangdong CN
- Chai; Songgang - Dongguan City CN
| Patent | Date |
|---|---|
| Thermosetting resin composition and uses thereof Grant 10,208,188 - Du , et al. Feb | 2019-02-19 |
| Thermosetting Resin Composition, Prepreg Containing Same, Laminated Board, And Printed Circuit Board App 20180346675 - Chen; Wenxin ; et al. | 2018-12-06 |
| Thermosetting resin composition and uses thereof Grant 10,053,547 - Du , et al. August 21, 2 | 2018-08-21 |
| Epoxy resin composition and copper clad laminate manufactured by using same Grant 9,475,970 - Du , et al. October 25, 2 | 2016-10-25 |
| Thermosetting Resin Composition And Uses Thereof App 20160264745 - Du; Cuiming ; et al. | 2016-09-15 |
| Thermosetting Resin Sandwich Prepreg, Preparation Method Thereof And Copper Clad Laminate Therefrom App 20160243798 - CHAI; Songgang | 2016-08-25 |
| Thermosetting Resin Composition And Uses Thereof App 20160229990 - DU; Cuiming ; et al. | 2016-08-11 |
| Epoxy Resin Composition And Copper Clad Laminate Manufactured By Using Same App 20130295388 - Du; Cuiming ; et al. | 2013-11-07 |
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