Chai; Lee Kian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chai; Lee Kian.The latest application filed is for "method for fabricating semiconductor package with multi-layer die contact and external contact".

Company Profile

0.10.9

Chai; Lee Kian - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating semiconductor package with multi-layer die contact and external contact Grant 7,550,315 - 'Khng , et al. June 23, 2	2009-06-23
Bow control in an electronic package Grant 7,465,488 - Kuan , et al. December 16, 2	2008-12-16
Method For Fabricating Semiconductor Package With Multi-layer Die Contact And External Contact App 20070262469 - 'KHNG; VICTOR TAN CHER ; et al.	2007-11-15
Method for fabricating semiconductor package with multi-layer metal bumps Grant 7,253,022 - 'Khng , et al. August 7, 2	2007-08-07
Bow control in an electronic package Grant 7,235,872 - Kuan , et al. June 26, 2	2007-06-26
Semiconductor package with wire bonded stacked dice and multi-layer metal bumps Grant 7,208,828 - Cher 'Khng , et al. April 24, 2	2007-04-24
Semiconductor package having substrate with multi-layer metal bumps Grant 7,202,556 - 'Khng , et al. April 10, 2	2007-04-10
Bow control in an electronic package Grant 7,161,236 - Kuan , et al. January 9, 2	2007-01-09
Bow Control In An Electronic Package App 20060244141 - Kuan; Lee Choon ; et al.	2006-11-02
Semiconductor package having wire bonded die and multi layer metal bumps App 20050173788 - Cher'Khng, Victor Tan ; et al.	2005-08-11
Bow control in an electronic package App 20050029552 - Kuan, Lee Choon ; et al.	2005-02-10
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged Grant 6,781,248 - Hui , et al. August 24, 2	2004-08-24
Method for fabricating BOC semiconductor package Grant 6,638,792 - Hui , et al. October 28, 2	2003-10-28
Semiconductor package having substrate with multi-layer metal bumps App 20030116866 - Cher 'Khng, Victor Tan ; et al.	2003-06-26
Bow control in an electronic package App 20030047797 - Kuan, Lee Choon ; et al.	2003-03-13
BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die Grant 6,507,114 - Hui , et al. January 14, 2	2003-01-14
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged App 20020172024 - Hui, Chong Chin ; et al.	2002-11-21
BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die App 20020100976 - Hui, Chong Chin ; et al.	2002-08-01
Method for fabricating BOC semiconductor package App 20020102831 - Hui, Chong Chin ; et al.	2002-08-01

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