Chae; Hyo-geun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chae; Hyo-geun.The latest application filed is for "test kit for semiconductor package and method for testing semiconductor package using the same".

Company Profile

0.4.6

Chae; Hyo-geun - Seoul KR
Chae; Hyo-geun - Chungcheongnam-do KR
Chae; Hyo-geun - Ahsan KR
Chae, Hyo-geun - Ahsan-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Test kit for semiconductor package and method for testing semiconductor package using the same Grant 7,017,428 - Min , et al. March 28, 2	2006-03-28
Wafer treatment method for protecting fuse box of semiconductor chip Grant 6,841,425 - Lee , et al. January 11, 2	2005-01-11
Test kit for semiconductor package and method for testing semiconductor package using the same App 20040112142 - Min, Byoung-Jun ; et al.	2004-06-17
Wafer treatment method for protecting fuse box of semiconductor chip App 20030080360 - Lee, Jae-Il ; et al.	2003-05-01
Socket including pressure conductive rubber and mesh for testing of ball grid array package Grant 6,489,790 - An , et al. December 3, 2	2002-12-03
Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith Grant 6,462,534 - Kang , et al. October 8, 2	2002-10-08
Method and apparatus for detecting defective markings on a semiconductor product App 20020092910 - Lim, Sung-Muk ; et al.	2002-07-18
Socket, Circuit Board, And Sub-circuit Board For Semiconductor Integrated Circuit Device App 20020037672 - MIN, BYOUNG JUN ; et al.	2002-03-28
Socket Pin And Socket For Electrical Testing Of Semiconductor Packages App 20020011864 - AN, YOUNG-SOO ; et al.	2002-01-31
Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith App 20010026152 - Kang, Seong-goo ; et al.	2001-10-04

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