Cha; Se Woong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cha; Se Woong.The latest application filed is for "method of manufacturing a package-on-package type semiconductor package".

Company Profile

12.21.21

Cha; Se Woong - Gyeonggi-do KR
Cha; Se Woong - Gwangju-si KR
Cha; Se Woong - Seoul N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Grant 11,424,180 - Paek , et al. August 23, 2	2022-08-23
Electronic device package and fabricating method thereof Grant 11,362,128 - Kim , et al. June 14, 2	2022-06-14
Method of Manufacturing a Package-on-Package Type Semiconductor Package App 20210175222 - Kim; Dong Jin ; et al.	2021-06-10
Electronic Device Package And Fabricating Method Thereof App 20210020679 - Kim; Jin Young ; et al.	2021-01-21
Wafer-level Stack Chip Package And Method Of Manufacturing The Same App 20210020535 - Ko; Yeong Beom ; et al.	2021-01-21
Method of manufacturing a package-on-package type semiconductor package Grant 10,867,984 - Kim , et al. December 15, 2	2020-12-15
Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-photosensitive Passivation Layers App 20200365504 - Paek; Jong Sik ; et al.	2020-11-19
Wafer-level stack chip package and method of manufacturing the same Grant 10,784,178 - Ko , et al. Sept	2020-09-22
Electronic device package and fabricating method thereof Grant 10,692,918 - Kim , et al.	2020-06-23
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Grant 10,672,699 - Paek , et al.	2020-06-02
Electronic Device Package And Fabricating Method Thereof App 20190393258 - Kim; Jin Young ; et al.	2019-12-26
Method of Manufacturing a Package-on-Package Type Semiconductor Package App 20190312021 - Kim; Dong Jin ; et al.	2019-10-10
Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-photosensitive Passivation Layers App 20190229050 - Paek; Jong Sik ; et al.	2019-07-25
Electronic device package and fabricating method thereof Grant 10,304,890 - Kim , et al.	2019-05-28
Method of manufacturing a package-on-package type semiconductor package Grant 10,290,621 - Kim , et al.	2019-05-14
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Grant 10,199,322 - Paek , et al. Fe	2019-02-05
Semiconductor package and manufacturing method thereof Grant 10,115,705 - Kim , et al. October 30, 2	2018-10-30
Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-photosensitive Passivation Layers App 20180138117 - Paek; Jong Sik ; et al.	2018-05-17
Electronic Device Package And Fabricating Method Thereof App 20180083061 - Kim; Jin Young ; et al.	2018-03-22
Method of Manufacturing a Package-on-Package Type Semiconductor Package App 20170373051 - Kim; Dong Jin ; et al.	2017-12-28
Electronic device package and fabricating method thereof Grant 9,831,282 - Kim , et al. November 28, 2	2017-11-28
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Grant 9,818,685 - Paek , et al. November 14, 2	2017-11-14
Method of manufacturing a package-on-package type semiconductor package Grant 9,741,701 - Kim , et al. August 22, 2	2017-08-22
Electronic Device Package And Fabricating Method Thereof App 20160365379 - Kim; Jin Young ; et al.	2016-12-15
Semiconductor Package and Manufacturing Method Thereof App 20160322334 - Kim; Jin Young ; et al.	2016-11-03
Package of finger print sensor and fabricating method thereof Grant 9,431,447 - Kim , et al. August 30, 2	2016-08-30
Semiconductor package and manufacturing method thereof Grant 9,406,639 - Kim , et al. August 2, 2	2016-08-02
Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-photosensitive Passivation Layers App 20160197032 - Paek; Jong Sik ; et al.	2016-07-07
Wafer-level Stack Chip Package And Method Of Manufacturing The Same App 20160133601 - Ko; Yeong Beom ; et al.	2016-05-12
Method of Manufacturing a Package-on-Package Type Semiconductor Package App 20160056079 - Kim; Dong Jin ; et al.	2016-02-25
Package Of Finger Print Sensor And Fabricating Method Thereof App 20150340399 - Kim; Jin Young ; et al.	2015-11-26
Package of finger print sensor and fabricating method thereof Grant 9,129,873 - Kim , et al. September 8, 2	2015-09-08
Semiconductor device and manufacturing method thereof Grant 9,123,543 - Jin , et al. September 1, 2	2015-09-01
Wafer level fan-out package with a fiducial die Grant 8,946,883 - Kim , et al. February 3, 2	2015-02-03
Package Of Finger Print Sensor And Fabricating Method Thereof App 20140138788 - Kim; Jin Young ; et al.	2014-05-22
Wafer Level Fan-Out Package With a Fiducial Die App 20140077366 - Kim; Sung Kyu ; et al.	2014-03-20
Semiconductor Package and Manufacturing Method Thereof App 20140042600 - Kim; Jin Young ; et al.	2014-02-13
Semiconductor device having redistribution layer Grant 8,058,726 - Jin , et al. November 15, 2	2011-11-15
Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof Grant 7,982,316 - Lee , et al. July 19, 2	2011-07-19

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.