Cha; Ki Bon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cha; Ki Bon.The latest application filed is for "semiconductor package and stacked semiconductor package having the same".

Company Profile

0.5.5

Cha; Ki Bon - Gyeonggi-do KR
Cha; Ki Bon - Chungcheiongbuk-do KR
Cha; Ki Bon - Shinbong dong Heungduk-ku KR
Cha; Ki Bon - Cheongju-Shi KR
Cha, Ki Bon - Chungcheongbuk-Do KR
Cha; Ki Bon - Choongcheongbuk-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and stacked semiconductor package having the same Grant 8,823,158 - Oh , et al. September 2, 2	2014-09-02
Semiconductor Package And Stacked Semiconductor Package Having The Same App 20130026651 - OH; Jae Sung ; et al.	2013-01-31
Semiconductor package and stacked semiconductor package having the same Grant 8,299,591 - Oh , et al. October 30, 2	2012-10-30
Semiconductor Package And Stacked Semiconductor Package Having The Same App 20100072598 - OH; Jae Sung ; et al.	2010-03-25
Stacked Package and Method of Fabricating the Same App 20080203552 - Kim; Dong You ; et al.	2008-08-28
Stack package and fabricating method thereof Grant 7,291,906 - Cha , et al. November 6, 2	2007-11-06
Stack package and manufacturing method thereof Grant 6,924,556 - Cha August 2, 2	2005-08-02
Stack package and fabricating method thereof App 20040150107 - Cha, Ki Bon ; et al.	2004-08-05
Stack package and manufacturing method thereof App 20040046005 - Cha, Ki Bon	2004-03-11
Chip-size semiconductor package Grant 5,977,643 - You , et al. November 2, 1	1999-11-02

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