Cha; Jaemin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cha; Jaemin.The latest application filed is for "tempered glass cutting method and cutting apparatus".

Company Profile

0.9.4

Cha; Jaemin - Asan-si KR
Cha; Jaemin - ChungCheongNam-Do KR
Cha; Jaemin - Gyeonggi-do KR
Cha; Jaemin - Seongnam-si N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tempered glass cutting method and cutting apparatus Grant 9,896,371 - Cha , et al. February 20, 2	2018-02-20
Low expansion glass filler, method of manufacturing the same and glass frit including the same Grant 9,656,907 - Kim , et al. May 23, 2	2017-05-23
Inorganic adhesive composition and hermetic sealing method using same Grant 9,656,908 - Lee , et al. May 23, 2	2017-05-23
Financial transaction machine Grant D756,064 - Budde , et al. May 10, 2	2016-05-10
Method of cutting chemically toughened glass Grant 9,169,154 - Lee , et al. October 27, 2	2015-10-27
Inorganic Adhesive Composition And Hermetic Sealing Method Using Same App 20150166404 - Lee; Kiyeon ; et al.	2015-06-18
Tempered Glass Cutting Method And Cutting Apparatus App 20150166390 - Cha; Jaemin ; et al.	2015-06-18
Financial transaction machine Grant D732,263 - Budde , et al. June 16, 2	2015-06-16
Method Of Cutting Chemically Toughened Glass App 20140182335 - Lee; Hoikwan ; et al.	2014-07-03
Low Expansion Glass Filler, Method Of Manufacturing The Same And Glass Frit Including The Same App 20140113134 - Kim; Jhee-Mann ; et al.	2014-04-24
Financial transaction machine Grant D678,652 - Budde , et al. March 19, 2	2013-03-19

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