Cha; Gi Bon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cha; Gi Bon.The latest application filed is for "ultra high density integrated circuit blp stack and method for fabricating the same".
- Cha; Gi Bon - Chungcheongbuk-do KR
- Cha; Gi Bon - Choongcheongbuk-Do KR
- Cha; Gi-Bon - Cheongju-si KR
- Cha; Gi Bon - Euiwang KR
| Patent | Date |
|---|---|
| Ultra high density integrated circuit BLP stack and method for fabricating the same Grant 6,399,420 - Cha , et al. June 4, 2 | 2002-06-04 |
| Ultra high density integrated circuit BLP stack and method for fabricating the same App 20010040278 - Cha, Gi Bon ; et al. | 2001-11-15 |
| Stacked bottom lead package in semiconductor devices and fabricating method thereof Grant 6,030,858 - Cha , et al. February 29, 2 | 2000-02-29 |
| Semiconductor package Grant 5,861,668 - Cha January 19, 1 | 1999-01-19 |
| Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor Grant 5,854,740 - Cha December 29, 1 | 1998-12-29 |
| Resin molded semiconductor package Grant 5,428,248 - Cha June 27, 1 | 1995-06-27 |
| Semiconductor package for a semiconductor chip having centrally located bottom bond pads Grant 5,363,279 - Cha November 8, 1 | 1994-11-08 |
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