Ceurter; Kevin J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ceurter; Kevin J..The latest application filed is for "connector for processor package".

Company Profile

4.6.7

Ceurter; Kevin J. - Olympia WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cable retention assemblies including torsional elements Grant 10,680,367 - Cheng , et al.	2020-06-09
Connector for processor package Grant 10,541,494 - Tran , et al. Ja	2020-01-21
Hydraulic bladder for CPU interconnection and cooling Grant 10,455,731 - Jensen , et al. Oc	2019-10-22
Connector For Processor Package App 20190052016 - TRAN; Donald T. ; et al.	2019-02-14
Warpage mitigation in printed circuit board assemblies Grant 10,178,763 - Yee , et al. J	2019-01-08
Hydraulic Bladder For Cpu Interconnection And Cooling App 20180263137 - JENSEN; RALPH W. ; et al.	2018-09-13
Connector with structures for bi-lateral decoupling of a hardware interface Grant 10,070,526 - Phares , et al. September 4, 2	2018-09-04
Connector With Structures For Bi-lateral Decoupling Of A Hardware Interface App 20180007788 - PHARES; Charles C. ; et al.	2018-01-04
Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion Grant 9,825,387 - Cheng , et al. November 21, 2	2017-11-21
Linear Edge Connector Retention App 20170288330 - Cheng; Feifei ; et al.	2017-10-05
Linear Edge Connector With A Cable Retention Mechanism Having A Body With A Groove With An Indentation To Receive A Bolster Plate Protrusion App 20170288331 - Cheng; Feifei ; et al.	2017-10-05
Integrated Circuit Package Support Structures App 20170178994 - Hui; Michael ; et al.	2017-06-22
Warpage Mitigation In Printed Circuit Board Assemblies App 20170181271 - Yee; Rashelle ; et al.	2017-06-22

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