| Patent | Date |
|---|
Microelectronic Structures Including Bridges
App 20220199536 - Karhade; Omkar G. ; et al. | 2022-06-23 |
Micro-electronic Package With Substrate Protrusion To Facilitate Dispense Of Underfill Between A Narrow Die-to-die Gap
App 20220165585 - LIN; Ziyin ; et al. | 2022-05-26 |
Dummy Die In A Recessed Mold Structure Of A Packaged Integrated Circuit Device
App 20220102231 - Modi; Mitul ; et al. | 2022-03-31 |
Dummy Die Structures Of A Packaged Integrated Circuit Device
App 20220102242 - Modi; Mitul ; et al. | 2022-03-31 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap
Grant 11,282,717 - Lin , et al. March 22, 2 | 2022-03-22 |
Microelectronic Structures Including Bridges
App 20210391273 - Dubey; Manish ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391295 - Karhade; Omkar G. ; et al. | 2021-12-16 |
Underfill Flow Management In Electronic Assemblies
App 20210343677 - Atadana; Frederick W. ; et al. | 2021-11-04 |
Open Cavity Bridge Co-planar Placement Architectures And Processes
App 20210305132 - KARHADE; Omkar ; et al. | 2021-09-30 |
Barrier Structures For Underfill Containment
App 20210249322 - Lin; Ziyin ; et al. | 2021-08-12 |
Substrate With Thermal Insulation
App 20210242107 - LI; Wei ; et al. | 2021-08-05 |
Full Package Vapor Chamber With Ihs
App 20210195798 - NEAL; Nicholas ; et al. | 2021-06-24 |
No Mold Shelf Package Design And Process Flow For Advanced Package Architectures
App 20210104490 - LI; Wei ; et al. | 2021-04-08 |
Semiconductor Package With Attachment And/or Stop Structures
App 20210066162 - CHAN ARGUEDAS; Sergio A. ; et al. | 2021-03-04 |
Soldered Metallic Reservoirs For Enhanced Transient And Steady-state Thermal Performance
App 20210035921 - NEAL; Nicholas ; et al. | 2021-02-04 |
Variable-thickness Integrated Heat Spreader (ihs)
App 20210028084 - Chan Arguedas; Sergio Antonio ; et al. | 2021-01-28 |
Protruding Sn Substrate Features For Epoxy Flow Control
App 20210020531 - CETEGEN; Edvin ; et al. | 2021-01-21 |
Corner Guard For Improved Electroplated First Level Interconnect Bump Height Range
App 20210020532 - VEHONSKY; Jacob ; et al. | 2021-01-21 |
Multi-package Assemblies Having Foam Structures For Warpage Control
App 20200402920 - Yu; Mufei ; et al. | 2020-12-24 |
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction
App 20200273768 - Karhade; Omkar ; et al. | 2020-08-27 |
Ic Die Package Thermal Spreader And Emi Shield Comprising Graphite
App 20200273811 - Mallik; Debendra ; et al. | 2020-08-27 |
Active Package Cooling Structures Using Molded Substrate Packaging Technology
App 20200273775 - Karhade; Omkar ; et al. | 2020-08-27 |
Coupled Cooling Fins In Ultra-small Systems
App 20200273772 - Uppal; Aastha ; et al. | 2020-08-27 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200227332 - Singh; Kumar Abhishek ; et al. | 2020-07-16 |
Dual Strip Backside Metallization For Improved Alt-fli Plating, Koz Minimization, Test Enhancement And Warpage Control
App 20200203240 - HAEHN; Nicholas S. ; et al. | 2020-06-25 |
Conformable Heat Sink Interface With A High Thermal Conductivity
App 20200146183 - Lofgreen; Kelly ; et al. | 2020-05-07 |
Liquid Metal Tim With Stim-like Performance With No Bsm And Bga Compatible
App 20200098661 - LOFGREEN; Kelly ; et al. | 2020-03-26 |
Thermally-optimized Tunable Stack In Cavity Package-on-package
App 20200043894 - VAKANAS; George ; et al. | 2020-02-06 |
Micro-electronic Package With Barrier Structure
App 20200006169 - WARREN; William ; et al. | 2020-01-02 |
Micro-electronic Package With Substrate Protrusion To Facilitate Dispense Of Underfill Between A Narrow Die-to-die Gap
App 20190304808 - LIN; Ziyin ; et al. | 2019-10-03 |
Integrated Circuit Packages With Plates
App 20190279960 - Karhade; Omkar G. ; et al. | 2019-09-12 |
Underfill Material Flow Control For Reduced Die-to-die Spacing In Semiconductor Packages
App 20190148268 - KARHADE; Omkar G. ; et al. | 2019-05-16 |
Thermal interfaces for integrated circuit packages
Grant 10,290,561 - Cetegen , et al. | 2019-05-14 |
Dual-sided Package Assembly Processing
App 20190043776 - MALATKAR; Pramod ; et al. | 2019-02-07 |
Underfill material flow control for reduced die-to-die spacing in semiconductor packages
Grant 10,192,810 - Karhade , et al. Ja | 2019-01-29 |
Thermal Interfaces For Integrated Circuit Packages
App 20180090411 - Cetegen; Edvin ; et al. | 2018-03-29 |
Methods to form high density through-mold interconnections
Grant 9,741,692 - Karhade , et al. August 22, 2 | 2017-08-22 |
Thermal management solution for circuit products
Grant 9,477,275 - Choudhury , et al. October 25, 2 | 2016-10-25 |
Methods To Form High Density Through-mold Interconnections
App 20160268231 - Karhade; Omkar G. ; et al. | 2016-09-15 |
Controlling thermal interface material bleed out
Grant 8,951,846 - Krishnan , et al. February 10, 2 | 2015-02-10 |
Underfill Material Flow Control For Reduced Die-to-die Spacing In Semiconductor Packages
App 20150001717 - Karhade; Omkar G. ; et al. | 2015-01-01 |
Thermal Management Solution For Circuit Products
App 20140204534 - Choudhury; Arnab ; et al. | 2014-07-24 |
Controlling Thermal Interface Material Bleed Out
App 20140027899 - Krishnan; Gopi ; et al. | 2014-01-30 |
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