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Patent applications and USPTO patent grants for Cejka; Stanley Andrew.The latest application filed is for "package materials monitor and method therefor".
Patent | Date |
---|---|
Substrate dielectric crack prevention using interleaved metal plane Grant 10,537,019 - Zhou , et al. Ja | 2020-01-14 |
Methods and devices with enhanced grounding and shielding for wire bond structures Grant 10,256,193 - Golab , et al. | 2019-04-09 |
Package materials monitor and method therefor Grant 10,147,654 - Cejka , et al. De | 2018-12-04 |
Package Materials Monitor And Method Therefor App 20180112972 - CEJKA; STANLEY ANDREW ;   et al. | 2018-04-26 |
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