CATLAM LLC

Patent Applications and Registrations

Patent applications and USPTO patent grants for CATLAM LLC.The latest application filed is for "multi-layer circuit board with traces thicker than a circuit board".

Company Profile

30.18.14

CATLAM LLC - Sunnyvale CA US
CATLAM, LLC. - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-layer circuit board with traces thicker than a circuit board Grant 11,406,024 - Bahl August 2, 2	2022-08-02
Multi-Layer Circuit Board with Traces Thicker than a Circuit Board App 20210282274 - BAHL; Kenneth S.	2021-09-09
Multi-layer circuit board with traces thicker than a circuit board layer Grant 11,039,540 - Bahl June 15, 2	2021-06-15
Circuit board using non-catalytic laminate with catalytic adhesive overlay Grant 10,959,329 - Bahl , et al. March 23, 2	2021-03-23
Process For Forming Traces on a Catalytic Laminate App 20210051804 - BAHL; Kenneth S. ; et al.	2021-02-18
Catalytic Laminate with Conductive Traces formed during Lamination App 20210022252 - BAHL; Kenneth S ; et al.	2021-01-21
Circuit Board using non-catalytic laminate with catalytic adhesive overlay App 20200404785 - BAHL; Kenneth S. ; et al.	2020-12-24
Semi-Additive Process for Printed Circuit Boards App 20200389983 - BAHL; Kenneth S. ; et al.	2020-12-10
Process for forming traces on a catalytic laminate Grant 10,849,233 - Bahl , et al. November 24, 2	2020-11-24
Catalytic laminate with conductive traces formed during lamination Grant 10,827,624 - Bahl , et al. November 3, 2	2020-11-03
Catalytic circuit board with traces and vias Grant 10,806,029 - Bahl , et al. October 13, 2	2020-10-13
Process for printed circuit boards using backing foil Grant 10,765,012 - Bahl , et al. Sep	2020-09-01
Method for making a multi-layer circuit board using conductive paste with interposer layer Grant 10,765,003 - Bahl , et al. Sep	2020-09-01
Multi-Layer Circuit Board with Traces Thicker than a Circuit Board Layer App 20200214144 - BAHL; Kenneth S.	2020-07-02
Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive Grant 10,685,931 - Bahl , et al.	2020-06-16
Method for wafer level packaging Grant 10,573,610 - Bahl , et al. Feb	2020-02-25
Method for making a Multi-Layer Circuit Board using conductive Paste with Interposer layer App 20190320530 - BAHL; Kenneth S. ; et al.	2019-10-17
Multi-layer circuit board using interposer layer and conductive paste Grant 10,349,520 - Karavakis , et al. July 9, 2	2019-07-09

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