Castro; Abram

Patent Applications and Registrations

Patent applications and USPTO patent grants for Castro; Abram.The latest application filed is for "packaged semiconductor system having unidirectional connections to discrete components".

Company Profile

4.16.23

Castro; Abram - Carrollton TX
Castro; Abram - Fort Worth TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged semiconductor system having unidirectional connections to discrete components Grant 10,756,013 - Gandhi , et al. A	2020-08-25
Printed adhesion deposition to mitigate integrated circuit package delamination Grant 10,727,085 - Lin , et al.	2020-07-28
Packaged Semiconductor System Having Unidirectional Connections To Discrete Components App 20200185323 - Gandhi; Saumya ; et al.	2020-06-11
Packaged semiconductor system having unidirectional connections to discrete components Grant 10,566,276 - Gandhi , et al. Feb	2020-02-18
QFN Device Having A Mechanism That Enables An Inspectable Solder Joint When Attached To A PWB And Method Of Making Same App 20190378783 - Castro; Abram ; et al.	2019-12-12
Acoustic Device Package And Method Of Making App 20190214964 - Tuncer; Enis ; et al.	2019-07-11
Printed adhesion deposition to mitigate integrated circuit delamination Grant 10,347,508 - Lin , et al. July 9, 2	2019-07-09
Packaged Semiconductor System Having Unidirectional Connections To Discrete Components App 20190139883 - Gandhi; Saumya ; et al.	2019-05-09
Acoustic device package and method of making Grant 10,284,172 - Tuncer , et al.	2019-05-07
Plastic-packaged semiconductor device having wires with polymerized insulating layer Grant 10,199,348 - Zhang , et al. Fe	2019-02-05
Method of packaging a circuit Grant 9,875,930 - Gallegos , et al. January 23, 2	2018-01-23
Packaged device with additive substrate surface modification Grant 9,780,017 - Cook , et al. October 3, 2	2017-10-03
Printed Adhesion Deposition To Mitigate Integrated Circuit Delamination App 20170271174 - LIN; YONG ; et al.	2017-09-21
Printed Adhesion Deposition To Mitigate Integrated Circuit Delamination App 20170194170 - LIN; YONG ; et al.	2017-07-06
Method for preventing die pad delamination Grant 9,601,414 - Zhang , et al. March 21, 2	2017-03-21
Packaged Device with Additive Substrate Surface Modification App 20170053854 - Cook; Benjamin Stassen ; et al.	2017-02-23
Method of making integrated circuit Grant 9,536,781 - Gallegos , et al. January 3, 2	2017-01-03
Packaged device with additive substrate surface modification Grant 9,524,926 - Cook , et al. December 20, 2	2016-12-20
Acoustic Device Package And Method Of Making App 20160322557 - Tuncer; Enis ; et al.	2016-11-03
Packaging A Semiconductor Device Having Wires With Polymerized Insulator Skin App 20160307866 - Zhang; Rongwei ; et al.	2016-10-20
Packaging a semiconductor device having wires with polymerized insulator skin Grant 9,378,984 - Zhang , et al. June 28, 2	2016-06-28
Method For Preventing Die Pad Delamination App 20160181183 - Zhang; Rongwei ; et al.	2016-06-23
Packaged semiconductor device having leadframe features as pressure valves against delamination Grant 9,305,869 - Zhang , et al. April 5, 2	2016-04-05
Packaged Device With Additive Substrate Surface Modification App 20160093558 - COOK; BENJAMIN STASSEN ; et al.	2016-03-31
Flip Chip Led Package App 20160064630 - CASTRO; ABRAM	2016-03-03
Method for preventing die pad delamination Grant 9,214,440 - Zhang , et al. December 15, 2	2015-12-15
Method Of Making Integrated Circuit App 20150357238 - Gallegos; Bernardo ; et al.	2015-12-10
Integrated circuit and method of making Grant 9,142,472 - Gallegos , et al. September 22, 2	2015-09-22
Method Of Fabricating A Circuit App 20150111344 - Gallegos; Bernardo ; et al.	2015-04-23
Packaging A Semiconductor Device Having Wires With Polymerized Insulator Skin App 20150037938 - Zhang; Rongwei ; et al.	2015-02-05
Method for Preventing Corrosion of Copper-Aluminum Intermetallic Compounds App 20130277825 - Zhang; Rongwei ; et al.	2013-10-24
Plastic-packaged Semiconductor Device Having Wires With Polymerized Insulator Skin App 20130277816 - Zhang; Rongwei ; et al.	2013-10-24
Integrated Circuit And Method Of Making App 20130075890 - Gallegos; Bernardo ; et al.	2013-03-28
Integrated Circuit And Method Of Making App 20130075928 - Gallegos; Bernardo ; et al.	2013-03-28
Integrated Circuit And Method Of Making App 20130075894 - Gallegos; Bernardo ; et al.	2013-03-28

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