Casto; James J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Casto; James J..The latest application filed is for "method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements".

Company Profile

0.13.0

Casto; James J. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements Grant 6,732,266 - Anderson , et al. May 4, 2	2004-05-04
Integrated circuit package incorporating camouflaged programmable elements Grant 6,449,170 - Nguyen , et al. September 10, 2	2002-09-10
Method for positioning bond pads in a semiconductor die layout Grant 5,498,767 - Huddleston , et al. March 12, 1	1996-03-12
Method for making a lead-on-chip semiconductor device having peripheral bond pads Grant 5,455,200 - Bigler , et al. October 3, 1	1995-10-03
Lead-on chip semiconductor device having peripheral bond pads Grant 5,381,036 - Bigler , et al. January 10, 1	1995-01-10
Leadless semiconductor device and method for making the same Grant 5,172,214 - Casto December 15, 1	1992-12-15
Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation Grant 5,147,821 - McShane , et al. September 15, 1	1992-09-15
Method for fabricating a multichip semiconductor device having two interdigitated leadframes Grant 5,147,815 - Casto September 15, 1	1992-09-15
Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation Grant 5,105,259 - McShane , et al. April 14, 1	1992-04-14
TAB bonded semiconductor device having off-chip power and ground distribution Grant 5,060,052 - Casto , et al. October 22, 1	1991-10-22
Plastic pad array electronic AC device Grant 5,045,914 - Casto , et al. September 3, 1	1991-09-03
Multiple layer lead frame Grant 5,014,113 - Casto May 7, 1	1991-05-07
Flagless semiconductor package Grant 4,924,291 - Lesk , et al. May 8, 1	1990-05-08

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