Cassidy; Cathal

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cassidy; Cathal.The latest application filed is for "engineering high-performance palladium core magnesium oxide porous shell nanocatalysts via heterogeneous gas-phase synthesis".

Company Profile

2.9.9

Cassidy; Cathal - Okinawa JP
Cassidy; Cathal - Okinawa City JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Engineering high-performance palladium core magnesium oxide porous shell nanocatalysts via heterogeneous gas-phase synthesis Grant 10,828,622 - Sowwan , et al. November 10, 2	2020-11-10
Semiconductor device for wafer-scale integration Grant 10,332,931 - Cassidy , et al.	2019-06-25
Engineering High-performance Palladium Core Magnesium Oxide Porous Shell Nanocatalysts Via Heterogeneous Gas-phase Synthesis App 20180193820 - SOWWAN; Mukhles Ibrahim ; et al.	2018-07-12
Method of producing a semiconductor device with through-substrate via covered by a solder ball Grant 9,870,988 - Cassidy , et al. January 16, 2	2018-01-16
Method Of Producing A Semiconductor Device With Through-substrate Via Covered By A Solder Ball App 20170365551 - CASSIDY; Cathal ; et al.	2017-12-21
Method of producing a semiconductor device with through-substrate via covered by a solder ball Grant 9,773,729 - Cassidy , et al. September 26, 2	2017-09-26
Semiconductor device with through-substrate via covered by a solder ball Grant 9,735,101 - Cassidy , et al. August 15, 2	2017-08-15
Semiconductor Device For Wafer-scale Integration App 20170179183 - CASSIDY; Cathal ; et al.	2017-06-22
Metal induced nanocrystallization of amorphous semiconductor quantum dots Grant 9,633,842 - Singh , et al. April 25, 2	2017-04-25
Method of wafer-scale integration of semiconductor devices and semiconductor device Grant 9,608,035 - Cassidy , et al. March 28, 2	2017-03-28
Semiconductor Device With Through-substrate Via Covered By A Solder Ball App 20170025351 - CASSIDY; Cathal ; et al.	2017-01-26
Semiconductor device with through-substrate via covered by a solder ball and related method of production Grant 9,553,039 - Cassidy , et al. January 24, 2	2017-01-24
Method Of Producing A Semiconductor Device With Through-substrate Via Covered By A Solder Ball App 20170018518 - CASSIDY; Cathal ; et al.	2017-01-19
Metal Induced Nanocrystallization Of Amorphous Semiconductor Quantum Dots App 20160042948 - VIDYA DHAR; Singh ; et al.	2016-02-11
Semiconductor device with internal substrate contact and method of production Grant 9,245,843 - Kraft , et al. January 26, 2	2016-01-26
Method Of Wafer-scale Integration Of Semiconductor Devices And Semiconductor Device App 20150129999 - Cassidy; Cathal ; et al.	2015-05-14
Semiconductor Device With Internal Substrate Contact And Method Of Production App 20140367862 - Kraft; Jochen ; et al.	2014-12-18
Semiconductor Device With Through-substrate Via Covered By A Solder Ball And Related Method Of Production App 20140339698 - Cassidy; Cathal ; et al.	2014-11-20

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