Caskey; Terrence
Patent Applications and Registrations
Patent applications and USPTO patent grants for Caskey; Terrence.The latest application filed is for "method and structures for heat dissipating interposers".
Company Profile
3.45.48
- Caskey; Terrence - Santa Cruz CA
- Caskey; Terrence - San Diego CA
- Caskey; Terrence - San Jose CA
- Caskey, Terrence - Phoenix AZ
Patent Activity
| Patent | Date |
|---|---|
| Method and structures for heat dissipating interposers Grant 10,475,733 - Uzoh , et al. Nov | 2019-11-12 |
| Method of fabricating low CTE interposer without TSV structure Grant 10,396,114 - Woychik , et al. A | 2019-08-27 |
| BVA interposer Grant 10,297,582 - Caskey , et al. | 2019-05-21 |
| Method And Structures For Heat Dissipating Interposers App 20190139878 - Uzoh; Cyprian Emeka ; et al. | 2019-05-09 |
| Method for fabricating a carrier-less silicon interposer Grant 10,181,411 - Newman , et al. Ja | 2019-01-15 |
| Method and structures for heat dissipating interposers Grant 10,103,094 - Uzoh , et al. October 16, 2 | 2018-10-16 |
| Reliable device assembly Grant 9,893,030 - Uzoh , et al. February 13, 2 | 2018-02-13 |
| Microelectronic package with stacked microelectronic units and method for manufacture thereof Grant 9,876,002 - Caskey , et al. January 23, 2 | 2018-01-23 |
| Method And Structures For Heat Dissipating Interposers App 20170365546 - Uzoh; Cyprian Emeka ; et al. | 2017-12-21 |
| Method Of Fabricating Low Cte Interposer Without Tsv Structure App 20170194373 - Woychik; Charles G. ; et al. | 2017-07-06 |
| Structures for heat dissipating interposers Grant 9,685,401 - Uzoh , et al. June 20, 2 | 2017-06-20 |
| Microelectronic Package With Stacked Microelectronic Units And Method For Manufacture Thereof App 20170141094 - Caskey; Terrence ; et al. | 2017-05-18 |
| Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface Grant 9,615,456 - Haba , et al. April 4, 2 | 2017-04-04 |
| Thin wafer handling and known good die test method Grant 9,601,398 - Woychik , et al. March 21, 2 | 2017-03-21 |
| Microelectronic package with stacked microelectronic units and method for manufacture thereof Grant 9,583,475 - Caskey , et al. February 28, 2 | 2017-02-28 |
| Method of fabricating low CTE interposer without TSV structure Grant 9,558,964 - Woychik , et al. January 31, 2 | 2017-01-31 |
| BVA interposer Grant 9,502,390 - Caskey , et al. November 22, 2 | 2016-11-22 |
| Reliable Device Assembly App 20160329290 - Haba; Belgacem ; et al. | 2016-11-10 |
| Low-stress TSV design using conductive particles Grant 9,433,100 - Woychik , et al. August 30, 2 | 2016-08-30 |
| Method of forming a reliable microelectronic assembly Grant 9,398,700 - Uzoh , et al. July 19, 2 | 2016-07-19 |
| Metal PVD-free conducting structures Grant 9,379,008 - Uzoh , et al. June 28, 2 | 2016-06-28 |
| Methods and structure for carrier-less thin wafer handling Grant 9,355,905 - Uzoh , et al. May 31, 2 | 2016-05-31 |
| Reduced stress TSV and interposer structures Grant 9,349,669 - Uzoh , et al. May 24, 2 | 2016-05-24 |
| Carrier-less Silicon Interposer App 20160079090 - Newman; Michael ; et al. | 2016-03-17 |
| Bva Interposer App 20160079214 - Caskey; Terrence ; et al. | 2016-03-17 |
| Microelectronic Package With Stacked Microelectronic Units And Method For Manufacture Thereof App 20160035712 - Caskey; Terrence ; et al. | 2016-02-04 |
| Carrier-less silicon interposer Grant 9,237,648 - Newman , et al. January 12, 2 | 2016-01-12 |
| Method And Structures For Heat Dissipating Interposers App 20150340310 - Uzoh; Cyprian Emeka ; et al. | 2015-11-26 |
| Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20150334831 - Haba; Belgacem ; et al. | 2015-11-19 |
| Microelectronic package with stacked microelectronic units and method for manufacture thereof Grant 9,165,911 - Caskey , et al. October 20, 2 | 2015-10-20 |
| Methods And Structure For Carrier-less Thin Wafer Handling App 20150255345 - Uzoh; Cyprian Emeka ; et al. | 2015-09-10 |
| Method and structures for heat dissipating interposers Grant 9,123,780 - Uzoh , et al. September 1, 2 | 2015-09-01 |
| Structure for microelectronic packaging with bond elements to encapsulation surface Grant 9,095,074 - Haba , et al. July 28, 2 | 2015-07-28 |
| Reduced Stress Tsv And Interposer Structures App 20150187673 - Uzoh; Cyprian Emeka ; et al. | 2015-07-02 |
| Methods and structure for carrier-less thin wafer handling Grant 9,064,933 - Uzoh , et al. June 23, 2 | 2015-06-23 |
| Metal Pvd-free Conducting Structures App 20150162241 - Uzoh; Cyprian Emeka ; et al. | 2015-06-11 |
| High Strength Through-substrate Vias App 20150146393 - UZOH; CYPRIAN EMEKA ; et al. | 2015-05-28 |
| Reduced stress TSV and interposer structures Grant 9,000,600 - Uzoh , et al. April 7, 2 | 2015-04-07 |
| Metal PVD-free conducting structures Grant 8,981,564 - Woychik , et al. March 17, 2 | 2015-03-17 |
| Method Of Fabricating Low Cte Interposer Without Tsv Structure App 20150044820 - Woychik; Charles G. ; et al. | 2015-02-12 |
| Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20150034371 - Haba; Belgacem ; et al. | 2015-02-05 |
| Thin Wafer Handling and Known Good Die Test Method App 20150014688 - Woychik; Charles G. ; et al. | 2015-01-15 |
| Reliable Device Assembly App 20140376200 - Uzoh; Cyprian Emeka ; et al. | 2014-12-25 |
| Metal Pvd-free Conducting Structures App 20140339702 - Woychik; Charles G. ; et al. | 2014-11-20 |
| Low CTE interposer without TSV structure Grant 8,884,427 - Woychik , et al. November 11, 2 | 2014-11-11 |
| Structure for microelectronic packaging with bond elements to encapsulation surface Grant 8,878,353 - Haba , et al. November 4, 2 | 2014-11-04 |
| Thin wafer handling and known good die test method Grant 8,846,447 - Woychik , et al. September 30, 2 | 2014-09-30 |
| Low Cte Interposer Without Tsv Structure App 20140264794 - Woychik; Charles G. ; et al. | 2014-09-18 |
| Carrier-less Silicon Interposer App 20140240938 - Newman; Michael ; et al. | 2014-08-28 |
| Reduced Stress Tsv And Interposer Structures App 20140217607 - Uzoh; Cyprian Emeka ; et al. | 2014-08-07 |
| Microelectronic Package With Stacked Microelectronic Units And Method For Manufacture Thereof App 20140212996 - Caskey; Terrence ; et al. | 2014-07-31 |
| Low-stress Tsv Design Using Conductive Particles App 20140201994 - Woychik; Charles G. ; et al. | 2014-07-24 |
| High strength through-substrate vias Grant 8,785,790 - Uzoh , et al. July 22, 2 | 2014-07-22 |
| Reduced stress TSV and interposer structures Grant 8,772,946 - Uzoh , et al. July 8, 2 | 2014-07-08 |
| Methods And Structure For Carrier-less Thin Wafer Handling App 20140179099 - Uzoh; Cyprian Emeka ; et al. | 2014-06-26 |
| Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface App 20140175671 - Haba; Belgacem ; et al. | 2014-06-26 |
| Method And Structures For Heat Dissipating Interposers App 20140167267 - Uzoh; Cyprian Emeka ; et al. | 2014-06-19 |
| Vertical electrical interconnect formed on support prior to die mount Grant 8,742,602 - Caskey , et al. June 3, 2 | 2014-06-03 |
| Low-stress TSV design using conductive particles Grant 8,723,049 - Woychik , et al. May 13, 2 | 2014-05-13 |
| Microelectronic package with stacked microelectronic units and method for manufacture thereof Grant 8,723,327 - Caskey , et al. May 13, 2 | 2014-05-13 |
| Electrically interconnected stacked die assemblies Grant 8,723,332 - McElrea , et al. May 13, 2 | 2014-05-13 |
| Thin Wafer Handling And Known Good Die Test Method App 20140054763 - Woychik; Charles G. ; et al. | 2014-02-27 |
| Bva Interposer App 20140036454 - Caskey; Terrence ; et al. | 2014-02-06 |
| Electrically interconnected stacked die assemblies Grant 8,629,543 - McElrea , et al. January 14, 2 | 2014-01-14 |
| Reduced Stress Tsv And Interposer Structures App 20130328186 - Uzoh; Cyprian Emeka ; et al. | 2013-12-12 |
| High Strength Through-substrate Vias App 20130118784 - Uzoh; Cyprian ; et al. | 2013-05-16 |
| Microelectronic Package With Stacked Microelectronic Units And Method For Manufacture Thereof App 20130099387 - Caskey; Terrence ; et al. | 2013-04-25 |
| Hybrid Interposer App 20130070437 - Mohammed; Ilyas ; et al. | 2013-03-21 |
| Low-stress Tsv Design Using Conductive Particles App 20120314384 - Woychik; Charles G. ; et al. | 2012-12-13 |
| Wafer level surface passivation of stackable integrated circuit chips Grant 8,324,081 - McElrea , et al. December 4, 2 | 2012-12-04 |
| Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20110147943 - McElrea; Simon J. S. ; et al. | 2011-06-23 |
| Wafer level surface passivation of stackable integrated circuit chips Grant 7,923,349 - McElrea , et al. April 12, 2 | 2011-04-12 |
| Electrically Interconnected Stacked Die Assemblies App 20110037159 - McElrea; Simon J. S. ; et al. | 2011-02-17 |
| Chip Scale Stacked Die Package App 20090102038 - MCELREA; SIMON J.S. ; et al. | 2009-04-23 |
| Electrical Interconnect Formed by Pulsed Dispense App 20090068790 - Caskey; Terrence ; et al. | 2009-03-12 |
| Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20080315434 - McElrea; Simon J.S. ; et al. | 2008-12-25 |
| Three-dimensional Circuitry Formed On Integrated Circuit Device Using Two-dimensional Fabrication App 20080315407 - Andrews, JR.; Lawrence Douglas ; et al. | 2008-12-25 |
| Electrically Interconnected Stacked Die Assemblies App 20080303131 - McElrea; Simon J.S. ; et al. | 2008-12-11 |
| Vertical Electrical Interconnect Formed On Support Prior To Die Mount App 20080224279 - Caskey; Terrence ; et al. | 2008-09-18 |
| Electronic device with reduced entrapment of material between die and substrate electrical connections App 20050104180 - Lebonheur, Vassoudevane ; et al. | 2005-05-19 |
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