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Polygon integrated circuit (IC) packaging
Grant 11,410,894 - Arvin , et al. August 9, 2 | 2022-08-09 |
Direct bonded heterogeneous integration packaging structures
Grant 11,177,217 - Sikka , et al. November 16, 2 | 2021-11-16 |
Polygon Integrated Circuit (ic) Packaging
App 20210074599 - Arvin; Charles L. ; et al. | 2021-03-11 |
Electronic Device Console With Natural Draft Cooling
App 20210022239 - SIKKA; Kamal K. ; et al. | 2021-01-21 |
Electronic device console with natural draft cooling
Grant 10,834,808 - Bodenweber , et al. November 10, 2 | 2020-11-10 |
Direct Bonded Heterogeneous Integration Packaging Structures
App 20200144187 - Sikka; Kamal K. ; et al. | 2020-05-07 |
Direct bonded heterogeneous integration packaging structures
Grant 10,580,738 - Sikka , et al. | 2020-03-03 |
Direct Bonded Heterogeneous Integration Packaging Structures
App 20190295952 - Sikka; Kamal K. ; et al. | 2019-09-26 |
Under die surface mounted electrical elements
Grant 9,601,423 - Arvin , et al. March 21, 2 | 2017-03-21 |
Managing interconnect electromigration effects
Grant 9,477,568 - Allen-Ware , et al. October 25, 2 | 2016-10-25 |
Electronic Device Console With Natural Draft Cooling
App 20160021731 - BODENWEBER; Paul F. ; et al. | 2016-01-21 |
Electronic device console with natural draft cooling
Grant 9,226,426 - Bodenweber , et al. December 29, 2 | 2015-12-29 |
Managing Interconnect Electromigration Effects
App 20150094995 - Allen-Ware; Malcolm S. ; et al. | 2015-04-02 |
Passivation layer surface topography modifications for improved integrity in packaged assemblies
Grant 8,786,059 - Blander , et al. July 22, 2 | 2014-07-22 |
Electronic Device Console With Natural Draft Cooling
App 20140024465 - BODENWEBER; Paul F. ; et al. | 2014-01-23 |
Achieving mechanical and thermal stability in a multi-chip package
Grant 8,421,217 - Casey , et al. April 16, 2 | 2013-04-16 |
Passivation Layer Surface Topography Modifications For Improved Integrity In Packaged Assemblies
App 20120228748 - BLANDER; ALEXANDRE ; et al. | 2012-09-13 |
Passivation layer surface topography modifications for improved integrity in packaged assemblies
Grant 8,236,615 - Blander , et al. August 7, 2 | 2012-08-07 |
System And Method Of Achieving Mechanical And Thermal Stability In A Multi-chip Package
App 20120175766 - Casey; Jon A. ; et al. | 2012-07-12 |
Enhanced thermal management for improved module reliability
Grant 8,214,658 - Casey , et al. July 3, 2 | 2012-07-03 |
Achieving mechanical and thermal stability in a multi-chip package
Grant 8,202,765 - Casey , et al. June 19, 2 | 2012-06-19 |
Passivation Layer Surface Topography Modifications For Improved Integrity In Packaged Assemblies
App 20110121469 - Blander; Alexandre ; et al. | 2011-05-26 |
Tracking thermal mini-cycle stress
Grant 7,917,328 - Casey , et al. March 29, 2 | 2011-03-29 |
System and Method of Achieving Mechanical and Thermal Stability in a Multi-Chip Package
App 20100181665 - CASEY; Jon A. ; et al. | 2010-07-22 |
Tracking Thermal Mini-Cycle Stress
App 20100049466 - Casey; Jon A. ; et al. | 2010-02-25 |
Enhanced Thermal Management for Improved Module Reliability
App 20100049995 - Casey; Jon A. ; et al. | 2010-02-25 |
Method and apparatus for filling vias
Grant 7,449,067 - Andry , et al. November 11, 2 | 2008-11-11 |
Enhanced via structure for organic module performance
Grant 7,312,523 - Audet , et al. December 25, 2 | 2007-12-25 |
Electronic package repair process
Grant 7,294,909 - Casey , et al. November 13, 2 | 2007-11-13 |
Suspension for filling via holes in silicon and method for making the same
Grant 7,288,474 - Casey , et al. October 30, 2 | 2007-10-30 |
Suspension for filling via holes in silicon and method for making the same
Grant 7,202,154 - Casey , et al. April 10, 2 | 2007-04-10 |
Materials and method to seal vias in silicon substrates
Grant 7,199,450 - Casey , et al. April 3, 2 | 2007-04-03 |
Suspension for filling via holes in silicon and method for making the same
App 20070032078 - Casey; Jon A. ; et al. | 2007-02-08 |
Enhanced Via Structure For Organic Module Performance
App 20070023913 - Audet; Jean J. ; et al. | 2007-02-01 |
Materials And Method To Seal Vias In Silicon Substrates
App 20060255480 - Casey; Jon A. ; et al. | 2006-11-16 |
Method for integrating thermistor
Grant 7,078,259 - Casey , et al. July 18, 2 | 2006-07-18 |
Low-K dielectric material system for IC application
Grant 7,015,581 - Casey , et al. March 21, 2 | 2006-03-21 |
Low-k dielectric material system for IC application
App 20050200025 - Casey, Jon A. ; et al. | 2005-09-15 |
Electronic package repair process
App 20050176255 - Casey, Jon A. ; et al. | 2005-08-11 |
Method And Structure For Integrating Thermistor
App 20050151213 - Casey, Jon A. ; et al. | 2005-07-14 |
Electronic package repair process
Grant 6,916,670 - Casey , et al. July 12, 2 | 2005-07-12 |
A Suspension For Filling Via Holes In Silicon And Method For Making The Same
App 20050148164 - CASEY, JON A. ; et al. | 2005-07-07 |
Method and apparatus for filling vias
App 20050106834 - Andry, Paul S. ; et al. | 2005-05-19 |
Low-k dielectric material system for IC application
Grant 6,878,616 - Casey , et al. April 12, 2 | 2005-04-12 |
Method of selective plating on a substrate
Grant 6,823,585 - LaPlante , et al. November 30, 2 | 2004-11-30 |
Selective plating using dual lift-off mask
App 20040187303 - LaPlante, Mark J. ; et al. | 2004-09-30 |
Electronic package repair process
App 20040148765 - Casey, Jon A. ; et al. | 2004-08-05 |
Method of joining laminates for z-axis interconnection
App 20030041966 - Casey, Jon A. ; et al. | 2003-03-06 |
Multi-level web structure in use for thin sheet processing
App 20020092600 - Natarajan, Govindarajan ; et al. | 2002-07-18 |
Process For Screening Features On An Electronic Substrate With A Low Viscosity Paste
App 20020009539 - CASEY, JON A. ; et al. | 2002-01-24 |
Thermoelectric devices and methods for making the same
Grant 6,278,049 - Johnson , et al. August 21, 2 | 2001-08-21 |
Thermoelectric devices and methods for making the same
Grant 6,262,357 - Johnson , et al. July 17, 2 | 2001-07-17 |
Thermoelectric devices and methods for making the same
Grant 6,121,539 - Johnson , et al. September 19, 2 | 2000-09-19 |
Process for via fill
Grant 5,927,193 - Balz , et al. July 27, 1 | 1999-07-27 |
Method of forming a multilayer electronic packaging substrate with integral cooling channels
Grant 5,870,823 - Bezama , et al. February 16, 1 | 1999-02-16 |
Method of using an interface layer for stacked lamination sizing and sintering
Grant 5,866,470 - Casey , et al. February 2, 1 | 1999-02-02 |
Method for making ceramic substrates from thin and thick ceramic greensheets
Grant 5,601,672 - Casey , et al. February 11, 1 | 1997-02-11 |
Aluminum nitride body having graded metallurgy
Grant 5,552,107 - Casey , et al. September 3, 1 | 1996-09-03 |
Aluminum nitride body having graded metallurgy
Grant 5,552,232 - Casey , et al. September 3, 1 | 1996-09-03 |
Large ceramic article and method of manufacturing
Grant 5,541,005 - Bezama , et al. July 30, 1 | 1996-07-30 |
Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
Grant 5,480,503 - Casey , et al. January 2, 1 | 1996-01-02 |
Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering
Grant 5,304,517 - Casey , et al. April 19, 1 | 1994-04-19 |
Process for fabricating a low dielectric composite substrate
Grant 5,277,725 - Acocella , et al. January 11, 1 | 1994-01-11 |
Phenyl-endcapped depolymerizable polymer
Grant 5,147,741 - Araps , et al. September 15, 1 | 1992-09-15 |
Low dielectric composite substrate
Grant 5,139,851 - Acocella , et al. August 18, 1 | 1992-08-18 |
Process for fabricating a low dielectric composite substrate
Grant 5,135,595 - Acocella , et al. August 4, 1 | 1992-08-04 |
Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
Grant 4,885,038 - Anderson, Jr. , et al. December 5, 1 | 1989-12-05 |
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