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name:-0.0064868927001953
name:-0.009343147277832
name:-0.00054407119750977
Casati; Paolo Patent Filings

Casati; Paolo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Casati; Paolo.The latest application filed is for "method for manufacturing semiconductor devices, and corresponding device".

Company Profile
0.8.4
  • Casati; Paolo - Sesto San Giovanni IT
  • Casati; Paolo - Sesto S. Giovanni IT
  • Casati; Paolo - Sesto San Giovanni Milan
  • Casati; Paolo - Sesto San giovanni Milano
  • Casati, Paolo - Sesto S. Giovanni MI
  • Casati; Paolo - Milan IT
  • Casati; Paolo - Giovanni IT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Manufacturing Semiconductor Devices, And Corresponding Device
App 20180053709 - Crema; Paolo ;   et al.
2018-02-22
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process
Grant 7,459,771 - Casati , et al. December 2, 2
2008-12-02
Optical communication module
Grant 7,192,200 - Casati , et al. March 20, 2
2007-03-20
Optical communication module
App 20060072882 - Casati; Paolo ;   et al.
2006-04-06
Lead-frame for electonic devices with extruded pads
App 20050189625 - Deodato, Claudio ;   et al.
2005-09-01
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process
App 20030209783 - Casati, Paolo ;   et al.
2003-11-13
Semiconductor device package with metal-polymer joint of controlled roughness
Grant 6,002,173 - Casati , et al. December 14, 1
1999-12-14
Method for fabricating an electronic device structure with studs locating lead frame on backing plate
Grant 5,763,296 - Casati , et al. June 9, 1
1998-06-09
Combination and method for coupling a heat sink to a semiconductor device
Grant 5,521,439 - Casati , et al. May 28, 1
1996-05-28
Modular power circuit assembly
Grant 5,353,194 - Libretti , et al. October 4, 1
1994-10-04
Process and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device
Grant 5,244,838 - Casati , et al. September 14, 1
1993-09-14
Supersulfated heparins
Grant 5,164,378 - Conti , et al. November 17, 1
1992-11-17

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