Carter; Bradley H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Carter; Bradley H..The latest application filed is for "fuel injector with a trimmable heater and an increased heater contact area".

Company Profile

0.7.8

Carter; Bradley H. - Kokomo IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fuel injector with a trimmable heater and an increased heater contact area Grant 9,291,136 - Short , et al. March 22, 2	2016-03-22
Fuel Injector With A Trimmable Heater And An Increased Heater Contact Area App 20140097269 - SHORT; JASON C. ; et al.	2014-04-10
Fuel Injector with a Trimmable Heater and an Increased Heater Contact Area App 20120048962 - Short; Jason C. ; et al.	2012-03-01
Ultra-thick thick film on ceramic substrate App 20090001546 - Flederbach; Lynda G. ; et al.	2009-01-01
Method for improving the thermal cycled adhesion of thick-film conductors on dielectric Grant 7,294,390 - Carter , et al. November 13, 2	2007-11-13
Electronic assembly with controlled solder joint thickness App 20060255476 - Kuhlman; Frederick F. ; et al.	2006-11-16
Method for improving the thermal cycled adhesion of thick-film conductors on dielectric App 20060240231 - Carter; Bradley H. ; et al.	2006-10-26
Lead-based solder alloys containing copper Grant 6,811,892 - Yeh , et al. November 2, 2	2004-11-02
Lead-free solder alloy and solder reflow process Grant 6,767,411 - Yeh , et al. July 27, 2	2004-07-27
Lead-based solder alloys containing copper App 20040035909 - Yeh, Shing ; et al.	2004-02-26
Leach-resistant solder alloys for silver-based thick-film conductors Grant 6,630,251 - Carter , et al. October 7, 2	2003-10-07
Lead-free solder alloy and solder reflow process App 20030175146 - Yeh, Shing ; et al.	2003-09-18
Solder process and solder alloy therefor Grant 6,619,536 - Yeh , et al. September 16, 2	2003-09-16
Solder Process And Solder Alloy Therefor App 20030155402 - Yeh, Shing ; et al.	2003-08-21
Solder process and solder alloy therefor Grant 6,570,260 - Yeh , et al. May 27, 2	2003-05-27

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