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Patent applications and USPTO patent grants for Cartas; Marco Aurelio.The latest application filed is for "channeled lids for integrated circuit packages".
Patent | Date |
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Channeled Lids For Integrated Circuit Packages App 20200395269 - Dubey; Manish ;   et al. | 2020-12-17 |
Integrated Circuit Packages With Solder Thermal Interface Materials With Embedded Particles App 20200381332 - Saha; Amitesh ;   et al. | 2020-12-03 |
Integrated Circuit Packages With Thermal Interface Materials With Different Material Compositions App 20200373220 - Chan Arguedas; Sergio Antonio ;   et al. | 2020-11-26 |
Thin Line Dam On Underfill Material To Contain Thermal Interface Materials App 20200126887 - Lin; Ziyin ;   et al. | 2020-04-23 |
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