Carson; Flynn P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Carson; Flynn P..The latest application filed is for "flexible package architecture concept in fanout".
- Carson; Flynn P. - Redwood City CA
| Patent | Date |
|---|---|
| Wafer-level passive array packaging Grant 11,395,408 - Morrison , et al. July 19, 2 | 2022-07-19 |
| Flexible Package Architecture Concept in Fanout App 20220157680 - Shanmugam; Karthik ; et al. | 2022-05-19 |
| Wafer-Level Passive Array Packaging App 20220071013 - Morrison; Scott D. ; et al. | 2022-03-03 |
| Cell Packaging Techniques App 20220013834 - Marasco; Angelo V. ; et al. | 2022-01-13 |
| Substrate-less integrated components Grant 10,991,659 - Carson , et al. April 27, 2 | 2021-04-27 |
| Substrate-less Integrated Components App 20200144142 - Carson; Flynn P. ; et al. | 2020-05-07 |
| Stacked printed circuit board packages Grant 10,631,410 - Provencher , et al. | 2020-04-21 |
| Substrate-less integrated components Grant 10,535,611 - Carson , et al. Ja | 2020-01-14 |
| Vertical interconnects for self shielded system in package (SiP) modules Grant 10,522,475 - Lee , et al. Dec | 2019-12-31 |
| VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES App 20190027445 - Lee; Meng Chi ; et al. | 2019-01-24 |
| Vertical interconnects for self shielded system in package (SiP) modules Grant 10,115,677 - Lee , et al. October 30, 2 | 2018-10-30 |
| Self shielded system in package (SiP) modules Grant 10,109,593 - Lee , et al. October 23, 2 | 2018-10-23 |
| Stacked Printed Circuit Board Packages App 20180092213 - Provencher; Corey S. ; et al. | 2018-03-29 |
| Carrier Ultra Thin Substrate App 20180082858 - Hsu; Jun Chung ; et al. | 2018-03-22 |
| Carrier ultra thin substrate Grant 9,899,239 - Hsu , et al. February 20, 2 | 2018-02-20 |
| VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES App 20170301631 - Lee; Meng Chi ; et al. | 2017-10-19 |
| Vertical interconnects for self shielded system in package (SiP) modules Grant 9,721,903 - Lee , et al. August 1, 2 | 2017-08-01 |
| Vertical Interconnects For Self Shielded System In Package (sip) Modules App 20170179039 - Lee; Meng Chi ; et al. | 2017-06-22 |
| Dual molded stack TSV package Grant 9,679,801 - Lai , et al. June 13, 2 | 2017-06-13 |
| Substrate-less Integrated Components App 20170148744 - Carson; Flynn P. ; et al. | 2017-05-25 |
| Carrier Ultra Thin Substrate App 20170135219 - Hsu; Jun Chung ; et al. | 2017-05-11 |
| 3D integration of fanout wafer level packages Grant 9,589,936 - Zhai , et al. March 7, 2 | 2017-03-07 |
| SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES App 20170025361 - Lee; Meng Chi ; et al. | 2017-01-26 |
| Dual Molded Stack Tsv Package App 20160358889 - Lai; Kwan-Yu ; et al. | 2016-12-08 |
| 3d Integration Of Fanout Wafer Level Packages App 20160148904 - ZHAI; Jun ; et al. | 2016-05-26 |
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