Carson; Flynn

Patent Applications and Registrations

Patent applications and USPTO patent grants for Carson; Flynn.The latest application filed is for "semiconductor device and method of forming emi shielding layer with conductive material around semiconductor die".

Company Profile

1.35.31

Carson; Flynn - Redwood City CA
Carson; Flynn - Singapore CA
Carson; Flynn - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die Grant 10,643,952 - Pagaila , et al.	2020-05-05
Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die App 20170018507 - Pagaila; Reza A. ; et al.	2017-01-19
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die Grant 9,484,279 - Pagaila , et al. November 1, 2	2016-11-01
Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages Grant 9,331,007 - Yoon , et al. May 3, 2	2016-05-03
Stacked integrated circuit package system Grant 9,236,319 - Ha , et al. January 12, 2	2016-01-12
Integrated circuit package system with input/output expansion Grant 8,723,302 - Chandra , et al. May 13, 2	2014-05-13
Semiconductor Device and Method of Forming Conductive Ink Layer as Interconnect Structure Between Semiconductor Packages App 20140103509 - Yoon; Insang ; et al.	2014-04-17
Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground Grant 8,598,690 - Chandra , et al. December 3, 2	2013-12-03
Integrated circuit package system for package stacking and method of manufacture therefor Grant 8,409,920 - Pendse , et al. April 2, 2	2013-04-02
Integrated circuit packaging system with pad connection and method of manufacture thereof Grant 8,241,965 - Bathan , et al. August 14, 2	2012-08-14
Semiconductor Device and Method of Electrically Connecting a Shielding Layer to Ground Through a Conductive Via Disposed in Peripheral Region around Semiconductor Die App 20120119348 - Chandra; Harry ; et al.	2012-05-17
Mountable integrated circuit package system with substrate having a conductor-free recess Grant 8,129,832 - Carson , et al. March 6, 2	2012-03-06
Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die Grant 8,110,441 - Chandra , et al. February 7, 2	2012-02-07
Integrated Circuit Package System For Package Stacking And Method Of Manufacture Thereof App 20110306168 - Pendse; Rajendra D. ; et al.	2011-12-15
Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die App 20110298101 - Pagaila; Reza A. ; et al.	2011-12-08
Stacked integrated circuit package system and method for manufacturing thereof Grant 8,067,268 - Carson , et al. November 29, 2	2011-11-29
Plastic ball grid array package with integral heatsink Grant 8,030,756 - Lee , et al. October 4, 2	2011-10-04
Integrated Circuit Packaging System With Pad Connection And Method Of Manufacture Thereof App 20110079886 - Bathan; Henry Descalzo ; et al.	2011-04-07
Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package Grant 7,829,382 - Karnezos , et al. November 9, 2	2010-11-09
Stacked Integrated Circuit Package System And Method For Manufacturing Thereof App 20100224979 - Carson; Flynn ; et al.	2010-09-09
Stacked integrated circuit package system Grant 7,750,454 - Carson , et al. July 6, 2	2010-07-06
Integrated circuit package system with stacking module Grant 7,741,154 - Ha , et al. June 22, 2	2010-06-22
Integrated Circuit Package System With Input/output Expansion App 20100148344 - Chandra; Harry ; et al.	2010-06-17
Method For Making Semiconductor Multipackage Module Including Die And Inverted Land Grid Array Package Stacked Over Ball Grid Array Package App 20100136744 - Karnezos; Marcos ; et al.	2010-06-03
Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package Grant 7,692,279 - Karnezos , et al. April 6, 2	2010-04-06
Stacked integrated circuit package system and method of manufacture therefor Grant 7,687,315 - Carson March 30, 2	2010-03-30
Semiconductor Device and Method of Electrically Connecting a Shielding Layer to Ground Through a Conductive Via Disposed in Peripheral Region Around Semiconductor Die App 20100072582 - Chandra; Harry ; et al.	2010-03-25
Integrated Circuit Package System With Stacking Module App 20090243071 - Ha; Jong-Woo ; et al.	2009-10-01
Stacked Integrated Circuit Package System App 20090243072 - Ha; Jong-Woo ; et al.	2009-10-01
Stacked Integrated Circuit Package System App 20090243073 - Carson; Flynn ; et al.	2009-10-01
Mountable Integrated Circuit Package System With Substrate Having A Conductor-free Recess App 20090108428 - Carson; Flynn ; et al.	2009-04-30
Method for making a semiconductor multi-package module having inverted wire bond carrier second package Grant 7,494,847 - Karnezos , et al. February 24, 2	2009-02-24
Integrated Circuit Package System For Package Stacking App 20080258289 - Pendse; Rajendra D. ; et al.	2008-10-23
Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides Grant 7,429,786 - Karnezos , et al. September 30, 2	2008-09-30
Stacked Integrated Circuit Package System And Method Of Manufacture Therefor App 20080169549 - Carson; Flynn	2008-07-17
Method of fabricating a stacked integrated circuit package system Grant 7,354,800 - Carson April 8, 2	2008-04-08
Method for making a semiconductor multi-package module having inverted wire bond carrier second package App 20080020512 - Karnezos; Marcos ; et al.	2008-01-24
Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package App 20070278658 - Karnezos; Marcos ; et al.	2007-12-06
Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package Grant 7,253,511 - Karnezos , et al. August 7, 2	2007-08-07
Plastic Ball Grid Array Package with Integral Heatsink App 20070176289 - Lee; Taekeun ; et al.	2007-08-02
Method for making a semiconductor multi-package module having inverted bump chip carrier second package Grant 7,247,519 - Karnezos , et al. July 24, 2	2007-07-24
Integrated Circuit Package System App 20070109750 - Lee; Myung Kil ; et al.	2007-05-17
Method for manufacturing plastic ball grid array package with integral heatsink Grant 7,217,598 - Lee , et al. May 15, 2	2007-05-15
Stacked Integrated Circuit Package System App 20060244157 - Carson; Flynn	2006-11-02
Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides App 20060244117 - Karnezos; Marcos ; et al.	2006-11-02
Semiconductor multi-package module having inverted bump chip carrier second package Grant 7,053,477 - Karnezos , et al. May 30, 2	2006-05-30
Method for manufacturing plastic ball grid array package with integral heatsink App 20060019429 - Lee; Taekeun ; et al.	2006-01-26
Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package App 20060012018 - Karnezos; Marcos ; et al.	2006-01-19
Method for manufacturing plastic ball grid array with integral heatsink Grant 6,967,126 - Lee , et al. November 22, 2	2005-11-22
Integral heatsink ball grid array App 20050062149 - Karnezos, Marcos ; et al.	2005-03-24
Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor Grant 6,791,169 - Carson September 14, 2	2004-09-14
Semiconductor multi-package module having inverted bump chip carrier second package App 20040119152 - Karnezos, Marcos ; et al.	2004-06-24
Plastic ball grid array with integral heatsink App 20040043539 - Lee, Taekeun ; et al.	2004-03-04
Plastic semiconductor package Grant 6,661,083 - Lee , et al. December 9, 2	2003-12-09
Plastic ball grid array package with integral heatsink Grant 6,614,123 - Lee , et al. September 2, 2	2003-09-02
Integral heatsink plastic ball grid array App 20030030139 - Karnezos, Marcos ; et al.	2003-02-13
Plastic ball grid array package with integral heatsink App 20030025215 - Lee, Taekeun ; et al.	2003-02-06
Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor App 20020179330 - Carson, Flynn	2002-12-05
Plastic semiconductor package App 20020163015 - Lee, Sang D. ; et al.	2002-11-07
Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor Grant 6,468,830 - Carson October 22, 2	2002-10-22
Semiconductor inner lead bonding tool Grant 5,868,301 - Distefano , et al. February 9, 1	1999-02-09

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.